To: L. Adam Latham who wrote (63275 ) 8/24/1998 6:49:00 PM From: Proud_Infidel Respond to of 186894
Anyone care to take a guess as to what is inside Intel's Micrascan???? (See bolded area)pubs.cmpnet.com A service of Semiconductor Business News, CMP Media Inc. Story posted at 5 p.m. EDT/2 p.m. PDT, 8/24/98 SVGL announces 0.18-micron step-and-scan deep-UV tool By Jack Robertson SAN J0SE -- Silicon Valley Group Inc. here said today that its lithography division's latest Micrascan III+ step-and-scan tool can reach a 0.18-micron feature size in production using a 248-nanometer-wavelength deep-UV excimer laser. John Shamaly, SVG vice president of marketing, said the tool's own optics are sufficient to pattern 0.18-micron line widths without having to use ancillary phase-shift photomasks or optical proximity correction (OPC) photomasks. Unlike other deep-UV lithography machines, SVGL's uses reflective optics, catadioptric lenses (which mix reflective and refractive optics), and its own off-axis alignment to achieve the next-generation design rules. SVG Lithography, based in Wilton, Conn., first revealed a 0.18-micron capability with a custom Micrascan IIIx 248-nm tool that it developed for exclusive sale to Intel Corp. (see story in the August publication). Now a similar 0.18-micron advancement is available to other customers of the Micrascan III+ system. The company would not explain the difference between Intel's system and the new Micrascan III+ being offered now. SVG's Shamaly said the U.S. lithography firm hoped to keep well ahead of foreign rivals who he claimed were only now starting to ship limited quantities of step-and-scan deep-UV systems with quarter-micron capability. Micron Technology Inc., Boise, Ida., for instance, is using Netherlands-based ASM Lithography's step-and-repeat deep-UV tools to reach 0.21-micron feature size in production, but is not yet using step-and-scan systems. SVGL said the Micrascan III+ has a 55-mm tool-to-tool overlay, enlarged 26-mm-by-34-mm field size, and a throughput of up to 90 wafers an hour.