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To: Zeev Hed who wrote (19458)	9/10/1998 11:16:00 AM
From: BillyG	Respond to of 25960

Canon DUV stepper for .12 micron lines........ semibiznews.com A service of Semiconductor Business News, CMP Media Inc. Story posted 10:30 a.m.EDT/7:30 a.m. PDT, 9/10/98 I300I achieves 0.12-micron line width with Canon 300-mm stepper SANTA CLARA, Calif.-- The International 300-mm Initiative (I300I) has achieved 0.12-micron lines and 0.24-micron spaces on aluminum using the Canon FPA-3000EX3L 300-mm deep-ultraviolet (DUV) stepper, it was announced here today by the Semiconductor Equipment Division of Canon U.S.A. Inc. I300I achieved the results with standard DUV resist and titanium nitride antireflective coating. The wafers were then successfully etched. "With support from the Advanced Lithography Group of International Sematech and their research into optical extensions and advanced resists, we believe we can push the envelop below 0.12 micron, and possibly into the 0.10-micron era, on nearly an equal pace with 200-mm tools," said Dan Enloe, director of patterning technology at I300I. In April, Sematech announced it was achieving 0.10-micron geometry with 248-nm lithography on 200-mm wafers. According to Derek Youngson, acting general manager of I300I, the program has a role not only in the transition to 300-mm wafers, but also in extending process development to 0.15 and even 0.13 micron. "Our member companies want the equipment community to keep their momentum in 300-mm technology development," Youngson said. During demonstration projects with etching equipment suppliers, I300I has consistently printed 0.18-micron lines and spaces using the Canon FPA-3000EX3L stepper, with very tight CD control. Some suppliers are using the 0.16-micron-and-below images as well, Canon said.