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To: goldsnow who wrote (7035)	9/28/1998 9:32:00 PM
From: Katherine Derbyshire	Read Replies (3) \| Respond to of 10921

>>the next generation of memory chips - FeRAMS and DRAMS - will be using noble metals, including platinum, iridium, and ruthenium as electrodes in the capacitor structure. Apparently the use of the platinum group metals increases the lifetime and maintains the integrity of the films used on these chips.<< The amount of metal (any metal) used in semiconductor wafer processing is insignificant in terms of world metals markets. Next generation RAM chips use platinum group metals because the high dielectric constant material used as the insulator is highly reactive with other materials. Katherine