Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : CYRIX / NSM -- Ignore unavailable to you. Want to Upgrade?

To: FJB who wrote (29665)	9/29/1998 6:36:00 PM
From: Joe NYC	Respond to of 33344

Bob, For the MII, the die-size has been reduced from 119 sq. mm to 88 sq. mm, and the number of chips per wafer has been increased from 196 to 280. For the MediaGX, the South Portland fab will produce 396 chips per wafer, compared with the IBM yield of 211. The die-size for the MediGX has also been reduced from 119 sq. mm at the foundry, to 64 sq. mm at the South Portland fab. That's pretty impressive. I guess the reduction was from IBM's .30u process to NSM's .25u for MII. I don't know about MediaGX. Maybe it was redesigned somewhat, since the reduction seems very high. My suspicion is that the speed is still a problem. We seem to be stuck at 250 MHz and below. Joe