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Technology Stocks : Rambus (RMBS) - Eagle or Penguin -- Ignore unavailable to you. Want to Upgrade?


To: REH who wrote (7802)10/2/1998 7:24:00 PM
From: MileHigh  Read Replies (2) | Respond to of 93625
 
Gary and REH,

My logic was that individual investors (which I am one and not too savvy as well) try and wait to get in at a particular price and as they see the ask moving higher and higher quickly, they think they are going to miss the bus and put in a market order to buy, the old "greater fools" theory. I know this is nothing new, but could be appropriate for RMBS, they are the only ones buying low and selling high <ggg>

Thanks for sharing your knowledge. I appreciate it...

MileHigh



To: REH who wrote (7802)10/2/1998 7:26:00 PM
From: MileHigh  Respond to of 93625
 
Should I change my name to LoneStar? <g>

MileHigh



To: REH who wrote (7802)10/2/1998 7:38:00 PM
From: MileHigh  Respond to of 93625
 
Seems like integrating database technology into a Palm Pilot would require RDRAM?

Let's hope so!

Are you back in RMBS REH?

MileHigh

----------------------------

3Com palms Sybase database
By Erich Luening
Staff Writer, CNET News.com
September 28, 1998, 12:10 p.m. PT
Sybase and 3Com today announced a deal to bring Sybase's mobile database, Adaptive Server Anywhere, and its UltraLite technology, to the Palm Computing platform.

Slated to enter full beta testing in the next week, Sybase's UltraLite Database Technology for Palm Devices will provide software developers with a local, SQL-based relational database designed for applications built for 3Com's Palm Computing platform.

Sybase and 3Com plan to jointly market this package to their customers and business partners, according to the companies.

Sybase, along with Oracle and Microsoft, is investing additional development dollars into building software intended for mobile applications. Oracle is also building a Windows CE-based version of its Oracle Lite database software, expected to debut later this year.

The UltraLite Database Technology for Palm Devices is "tailored to have the features you need to run just the application you want and nothing else, saving Palm memory space while allowing users to access and use information in the database," said Cristina Lorentz, manager of embedded database technology at Sybase.

Sybase and 3Com are working with business partners in the health care and sales force automation industries to develop applications for the Palm Computing platform, like the Palm III connected organizer, the IBM WorkPad PC Companion, the Symbol SPT 1500, and the pdQ smartphone from Qualcomm.

UltraLite also delivers two-way server synchronization to the Palm Computing platform, "allowing access to corporate databases and enterprise resource planning systems," Lorentz explained. This will enable organizations to extend business applications such as sales force automation to the Palm platform.

The UltraLite Database Technology for Palm devices, Sybase's UltraLite deployment option of Adaptive Server Anywhere, is due to ship early next year. Pricing will be released then, the company said.



To: REH who wrote (7802)10/3/1998 7:59:00 AM
From: REH  Read Replies (4) | Respond to of 93625
 
NEC readies VCM core, but Intel not yet on board

Oct. 02, 1998 (Electronic Buyers News - CMP via COMTEX) -- Silicon
Valley- Having assembled third-party chipset support for its
virtual-channel memory architecture, NEC Electronics Inc. is poised to
thrust the new 133-MHz SDRAM core into the notebook and low-cost
desktop-PC markets.

However, without the endorsement of chipset industry leader Intel
Corp., which has thus far withheld its blessing, many observers predict
that NEC's VCM core will have a tough go of it in the broader market.

NEC, which released details of its VCM technology less than a year
ago, has moved quickly to build an industry framework to drive the core
into laptops and so-called value-line desktop PCs.

In addition to receiving full JEDEC committee approval as an open
industry standard in August, the U.S. arm of Japan's NEC Corp. has
garnered second-sourcing support from Siemens AG's Semiconductor Group.
NEC expects to disclose other DRAM sources this month, and industry
observers said the company is working closely with PC OEMs.

NEC today will also reveal that chipset vendors Acer Laboratories
Inc., Silicon Integrated Systems Corp. (SiS), and Via Technologies Inc.
will roll out VCM-enabled chipsets as early as this month, with volume
supplies coming later in the fourth quarter. Together with its industry
partners, NEC expects VC-SDRAM to penetrate the sub-$1,000 desktop-PC
market in systems coming out in the first half of 1999.

However, while Acer, Via, SiS, and other third-party chipset makers
share about 40% of the value-line PC market, the noticeable lack of
support from chipset market leader Intel could hinder VCM's adoption
rate, said Mario Morales, an analyst at International Data Corp.,
Mountain View, Calif. "Until NEC gets Intel, it's going to be very
difficult to standardize a solution," Morales said.

Intel, which has spent time and resources moving memory and PC makers
alike toward a 1999 adoption of the Direct Rambus DRAM interface,
didn't rule out future support for VCM. However, the company has made
no publicly stated provision for the architecture in its roadmap.

"Our memory direction is clear," said a spokesman for the Santa
Clara, Calif., chip maker. "We support Direct Rambus, and we're going
to enable that in 1999."

VCM is said to improve conventional SDRAM cores by adding SRAM
registers to temporarily store data in 16 distinct channels between the
input/output terminals and memory cells. Operating at a 133-MHz clock
rate, the SRAM buffers increase peak bandwidth to about 1 Gbyte/s,
according to Michael Ham, product marketing engineer for NEC's memory
group in Santa Clara.

To make room for the SRAM registers, NEC removed the VCM core's
control circuitry, moving logic functions to the memory controller. The
die size and cost of a VC-SDRAM exceeds that of a typical SDRAM by
about 3%, but improves system-level performance by up to 25%, according
to supporters. In systems built on a unified memory architecture, that
premium may be somewhat lower because of VCM's ability to replace level
2 cache, NEC said.

In a notebook PC, VCM can lower memory power consumption by up to
50%, according to Ham, because the addition of SRAM registers minimizes
the number of page misses, limiting how often the SDRAM banks must be
activated.

In the sub-$1,000 desktop-PC market-a segment in which non-Intel
chipsets and microprocessors have made appreciable gains-VCM-enabled
systems will sport an array of new chipsets, including the MVP4 from
Taipei, Taiwan-based Via, which is slated for production later this
year.

Because VC-SDRAM is a core, not a memory interface like Direct RDRAM
or SLDRAM, it requires no changes to pinouts or packages, which
simplifies the design process. "It's a no-brainer," said Dean Hays,
vice president of marketing at Via's U.S. operations in Fremont, Calif.

According to NEC, VCM-enabled chipsets will feature scalable
front-side bus speeds ranging from 66 to 133 MHz. In addition to
supporting VC-SDRAMs, the new chipsets will support PC-100/66 SDRAM and
EDO memory. All the chipsets will feature full AGP support, and some
will have an integrated 3D graphics controller, according to NEC.

Exactly how VCM will interrelate with other memory architectures
coming onto the market is unclear.

At about the same time that VC-SDRAM-enabled PCs enter the value-line
computer sector next year, several OEMs are expected to unveil high-end
desktop systems using Direct RDRAM.

Eventually, the two technologies should cross into the same
performance class, at which point Intel could consider offering chipset
support for the VCM architecture and meld the Rambus interface with the
new SDRAM core, analysts said.

"We'll have Rambus coming down from the top and VCM coming up from
the bottom, and, at some point they'll meet," said Steven Cullen, an
analyst at In-Stat Inc., Scottsdale, Ariz. "They could meet and merge."

Rambus Inc., Mountain View, Calif., said all its Direct RDRAM
licensees have the ability to design VC-SDRAM-compatible chips,
including NEC, which has not yet made a move in that direction.

Rambus predicts that VCM will have to earn respect in the market, and
that the two technologies will have to enter the same price/performance
sphere, before they are brought together.

"If somebody can prove the core at the low end, then we're confident
that with all the DRAM licensees out there, some company will merge the
two," said Subodh Toprani, vice president and general manager of
Rambus' logic division.

However, while its long-term prospects look good, until Intel
launches a VC-SDRAM chipset program, the technology could have
difficulty breaking into more mainstream markets, said Jim Handy, an
analyst at Dataquest Inc., San Jose.

"The one thing NEC really needs more than anything else is chipset
support," Handy said. "Until they get it, [VCM] isn't going to gain any
prominence."

-Mark Hachman contributed to this story.




To: REH who wrote (7802)10/3/1998 8:04:00 AM
From: REH  Read Replies (1) | Respond to of 93625
 
Hitachi puts TAB on RDRAM chip-scale

Oct. 02, 1998 (Electronic Engineering Times - CMP via COMTEX) -- Tokyo
- Hitachi Cable Ltd. has developed a tape automated bonding (TAB) tape
carrier optimized for Direct Rambus-memory chip-scale packages (CSP).

The Hitachi Chip Mounting Tape uses a package called the Hitachi
Compliant Chip Package, which is based on a micro-BGA developed by
Tessera Inc. and licensed to Hitachi Cable (Tokyo).

"We are going to supply the TAB tape to our customers so that they
can assemble RDRAMs in micro-BGAs by themselves," said Yoshihiro
Matsuyama, senior executive managing director of Hitachi Cable.

The TAB tape bonds an RDRAM to the tape with elastomers. The tape
functions as a polyimid flexible interposer for the inner leads, and
absorbs the different expansion rates of the die and the
printed-circuit board.

The approach enables use of the reel-to-reel method, cutting costs.
"It will be five times faster than the conventional method and the cost
will be about the same as the thin small-outline package eventually,"
said Gen Murakami, director of semiconductor packaging technology at
Hitachi Cable.

Murakami said the compliant-chip package supports a micro-BGA device
with a bare silicon surface. The package has a pin pitch of 0.5 mm to
1.27 mm, with up to 300 pins.

The package exceeds the Joint Electron Engineering Device Council
(Jedec) level 1 requirements for humidity and temperature. Hitachi
Cable developed an elastomer with a fluorine-type core for the TAB
tape, which withstands 1,000 hours in 85 percent humidity at
85degreesC, Murakami said.

TAB has been used since last year for flash memories and SRAM
packaged in CSPs and is being extended to micro-BGAs intended for
64-Mbit RDRAMs. Hitachi Cable plans to apply this technology to devices
like microprocessors and logic ICs as well and to license it in an
early stage so that multiple vendors can supply the TAB tapes.

Assembly plans afoot

Hitachi Cable plans a production capacity of 50 million units by the
end of next year. In parallel, the company will start an assembly
business using the technology with 10 million units of RDRAM assembly
capacity per year.

Rambus and Intel have worked to strengthen the in-frastructure, and
lower the expected costs, of CSP required for the RDRAMs.

Norihiko Naono, a director of Rambus Japan, said that "within three
years, a 2 billion-unit RDRAM market will emerge."

Naono said Rambus defined the electrical specifications and did not
specify the specific form of CSP. "It is the RDRAM vendors who actually
select the form of the package [for DRDRAM]. But thus far, only Hitachi
Cable has been able to supply a package. All of the RDRAM devices under
testing employ Hitachi Cable's package."

Akira Minamikawa, senior analyst at ICD Japan Ltd., said an adequate
supply of CSP is now a concern in the electronics industry. "Currently,
CSPs are mainly used for devices for compact portable equipment, but
from now on, RDRAMs will be the demand driver."