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To: Badger who wrote (66667)	10/14/1998 8:09:00 PM
From: Tenchusatsu	Read Replies (1) \| Respond to of 186894

Badger, <I thought using copper in chips was a dead issue with Intel, but Andy specifically said it was "in the Intel roadmap." Does anyone know anything about this, or was he talking in the abstract? I don't remember any upcoming Intel product that is slated to use this technology.> I think Intel wants to wait until the 0.13 micron process, one generation after 0.18 micron, before implementing copper. Intel engineers are on record saying that the benefits of copper aren't that great in the 0.18 micron process. Tenchusatsu

To: Badger who wrote (66667)	10/14/1998 8:48:00 PM
From: Paul Engel	Respond to of 186894

Badger - re: Intel & Copper Intel has repeatedly stated that their aluminum process technology will be "world class" through the 0.18 micron generation and that Copper will be implemented - as needed - in the 0.13 micron process due out in 2001/2002 time frame. Intel has also repeatedly stated that low dielectric constant insulators are also required to get the most out of copper and the low k insulators by themselves will help speed up circuits. Intel has published a number of papers on copper technology, mainly dealing with deposited and etched Cu films unlike the damascene copper techniques developed by IBM which deposit copper into trenches in insulators, followed by CMP removal of the unneeded copper. A simple analysis of IBM's new PowerPC with copper metallization on a 0.18 micron process indicates that Intel's current 0.25 micron aluminum process is basically equivalent as far as ultimate clock speeds are concerned. Paul