To: Immi who wrote (56658 ) 11/2/1998 11:06:00 AM From: Neil H Read Replies (1) | Respond to of 61433
Monday November 2, 10:17 am Eastern Time Company Press Release Ascend Delivers Next Generation High-density WAN Modem Modules for the MAX TNT New Series56(tm) II Digital Modem Module Based on Rockwell's Tripac Chipset, Increases Port Density and Adds New ISDN Functionality ALAMEDA, Calif.--(BUSINESS WIRE)--Nov. 2, 1998-- Ascend Communications, Inc. (Nasdaq:ASND - news), a leader in wide area networking (WAN) solutions for providers and users of the next generation public network, today announced the new Series56 II Digital Modem for its market-leading MAX TNT(tm) WAN access switch. Designed to reduce cost through increased modem port density and additional functionality, Ascend's Series56 II Digital Modem provides 48 modem and/or HDLC channel processing for ISDN support on a single-slot card. This effectively doubles the port density of the existing dual-slot modem module for the MAX TNT, adding new functionality. Using the new module, a single MAX TNT chassis, occupying 14 inches of rack height, can terminate a full DS-3 of dial-in calls for modems or ISDN. Ascend's Series56 II Digital Modem now enables service providers to terminate ISDN traffic using its new HDLC capability. Ascend's service provider customers now have two options in delivering these services. For the flexibility of offering ISDN and modem functions, service providers can use either the Series56 II Digital Modem, or if they know their MAX TNT is going to be heavily ISDN centric, Ascend offers the cost-effective Hybrid Access card. ''As our customer base grows, the need to conserve physical space and optimize our network resources becomes an even higher priority,'' said Steve Dougherty, director of Internet Operations for EarthLink Network, Inc. ''Ascend's Series56 II Digital Modem should allow us to maximize our MAX TNT configurations. And, with added ISDN support and increased port density, we'll be able to offer our members expanded service offerings, while cutting cost off our bottom line.'' ''Our longstanding strategic relationship with Rockwell has enabled us to double the port density per rack unit of the MAX TNT, allowing our large service providers to relieve their crowded high-density PoPs,'' said Kurt Bauer, vice president of product marketing for Ascend's Access Switching business unit. ''The Series56 II Digital Modem module is an important addition to the MAX TNT, a multiservice WAN access switch that enables our customers to offer a greater number of services, including MultiVoice, MultiVPN, Carrier Signaling integration, and comprehensive Last Mile solutions like Network Wholesaling and MultiDSL.'' Ascend's Series56 II Digital Modem is based on Rockwell Semiconductor Systems' CSM/3 Tripac chipset. Providing widespread compatibility, Ascend's ITU-T V.90 compliant Series56 II Digital Modem offers users dialing in on analog, digital, and cellular lines support for all standard modem modes and ISDN support. Ascend's V.90 software ensures reliable interoperability between all high-speed 56K modems, and enables faster connectivity speeds for next-generation Internet technologies. ''Ascend's use of Rockwell's Tripac chipset in its Series56 II Digital Modem demonstrates, through innovations in its high-density MAX TNT WAN access switch, the effectiveness of our increased-capability remote access platform,'' said Dean Grumlose, marketing director, Central Site Products for Rockwell Semiconductor Systems. ''Rockwell is committed to its ongoing relationship with Ascend, and we will continue to work closely with Ascend to bring out leading-edge solutions as the market evolves.'' Recently announced research results (http://www.ascend.com/3331.html) from International Data Corp. (IDC) rank Ascend's MAX(tm) family of WAN access switches number one in Remote Access Concentrator (RAC) revenue and port shipments. Ascend's MAX TNT with the Series56 II Digital Modem costs $24,000 (U.S.) and will be available in November 1998. Regards Neil