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To: Ram Seetharaman who wrote (4219)	11/6/1998 9:42:00 AM
From: DJBEINO	Read Replies (1) \| Respond to of 9582

16 Taiwan Microchip Foundries Operate OEM Services November 6, 1998 (TAIPEI) -- A total of 16 wafer foundry plants in Taiwan, including seven pure OEM makers, have begun semiconductor original equipment manufacturing (OEM) operations. More high-tech companies in Taiwan are entering the microchip OEM service business. The seven pure OEM semiconductor companies are: Taiwan Semiconductor Manufacturing Co., Ltd., United Microelectronics Corp., United Semiconductor Corp., United Silicon Inc., Asian Semiconductor Manufacturing Corp., United Integrated Circuits Corp. and Holtek Microelectronics Inc. Another local maker, Mosel Vitelic Inc., recently announced plans to spin off its six-in. wafer plant into an OEM unit. IDM makers that are also targeting OEM services include Winbond Electronics Corp., Powerchip Semiconductor Corp., Vanguard International Semiconductor Corp., Nan Ya Technology Corp., Acer Semiconductor Manufacturing Inc. (ASMI; formerly TI-Acer) and Hualon Microelectronics Corp. So-called strategic OEM makers include Macronix International Co., Ltd. and Promos Technologies Inc. ASMI announced in October that it had obtained the most advanced 0.25-micron manufacturing technology from IBM Corp. The company is negotiating with several buyers in Taiwan and the United States. Meanwhile, Nan Ya Technology said it will develop 0.35-micron technology by itself for its wafer foundry OEM operations, and it has already begun experimental production for some clients. Mosel Vitelic plans to slash its dynamic random access memory (DRAM) output to less than 10 percent of total production, and gradually increase wafer foundry operations. In the initial period, the company plans to target Taiwanese clients.

To: Ram Seetharaman who wrote (4219)	11/6/1998 9:45:00 AM
From: DJBEINO	Respond to of 9582

11-07-98 Chip Merger Deal Nears Virtual Collapse The semiconductor merger talks between Hyundai and LG groups appears to have all but fallen through, dealing a serious blow to Korea's overall corporate restructuring drive, sources said yesterday. Far from a merger, the semiconductor affiliates of the two groups seem determined to go their respective ways, undaunted by government threats to cut off credit lines and forced restructuring, the industry sources said. Top executives of Hyundai Electronics Ind. and LG Semicon continued their marathon negotiations until late last night, but again failed to narrow their differences over the selection of a foreign consulting firm to decide which firm will hold a 70-percent stake. The two companies also turned down a third alternative, U.S. agency Arthur D. Little, which had been recommended by the Federation of Korean Industries. The chip makers and the FKI agreed to seek other foreign or domestic consulting agencies, to ensure fairness and transparency in awarding a 70-percent stake in the joint entity to either of Hyundai or LG. But industry watchers, pointing to the limited time before the Nov. 30 deadline, said that it will be impossible to produce a compromise by the end of this month. ''Foot-dragging, even on the selection of a consulting firm, seems to suggest that the two chaebols do not intend to merge their semiconductor units,'' said an analyst at Daishin Securities Co. Earlier Thursday, economic ministers and Presidential aides, urging the two conglomerates to heed the Nov. 30 deadline, warned that Hyundai Electronics and LG Semicon will be punished if an agreement is not reached. Hyundai and LG executives, however, maintain that the proposed chip merger will create little synergies, due to their different technology systems and rapidly changing circumstances in the international chip markets. An FKI spokesman admitted, ''At present, the possibility of a voluntary settlement is slim.''