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To: DJBEINO who wrote (4225)11/7/1998 12:09:00 PM
From: DJBEINO  Respond to of 9582
 
Taiwanese deny dumping DRAM
Sandy Chen and Jack Robertson

Taipei, Taiwan- Executives at Taiwan's major semiconductor companies last week steadfastly denied Micron Technology Inc.'s allegations that they had engaged in dumping activities, and claimed the country's rapidly growing memory-chip business is still tiny compared with other global regions.

"If you add up all the DRAM capacity in Taiwan, it still isn't as big as [South Korea's] Samsung by itself," said Genda Hu, president of the Taiwan Semiconductor Industry Association. Taiwan's DRAM producers accounted for less than 5% of the U.S. market-too small a factor to hurt U.S. chip makers, he claimed. While acknowledging that Taiwan has expanded its DRAM capacity, he added that the gains stem from a small initial base.

Micron's action to file a dumping petition against Taiwan's DRAM suppliers last month could derail the island's unstated but lofty goal of becoming one of the world's largest DRAM producers.

Micron's petition claims that several Taiwanese companies and one U.S. vendor were selling DRAMs in the U.S. market below cost. The case raises the question of how the U.S. government will deal with foreign DRAM makers that use Taiwan-based foundries. These include Fujitsu, Matsushita, Mitsubishi, Siemens, and Toshiba.

After waging anti-dumping campaigns against Japan and South Korea over the years, Boise, Idaho-based Micron now views Taiwan as the next potential threat in the market, according to Donald Floyd, an analyst at ING Barings Taiwan Ltd., Taipei.

"It's a shot over the bow," Floyd said. "I hear Taiwan's DRAM makers, for the first time, are being qualified by major PC OEMs, but Micron may be trying to scare everybody [with their ITC suit]."

Some of the Taiwanese companies named in Micron's complaint believe they are being wrongly accused.

F.C. Tseng, president of foundry Taiwan Semiconductor Manufacturing Co. Ltd., said the portion of DRAMs his company makes for Fujitsu Ltd. "is a very small quantity." He added that TSMC's output for Fujitsu was in turn sold in Japan, not in the United States.

"In any event, we know TSMC's foundry prices on DRAMs are above our production costs, so we can't be dumping," Tseng said. He added that TSMC would welcome the chance to prove the company isn't dumping, and to clear up any aspersions cast on the foundry model.

For this same reason, TSMC wanted to be included in last year's dumping case filed by Micron against Taiwanese SRAM makers, but the U.S. Commerce Department refused to add the company. Some sources believe Commerce will again exclude TSMC on DRAMs.

Peter Chang, president of Hsinchu, Taiwan-based foundry United Semiconductor Corp., said none of his company's DRAM production is shipped to the United States, but goes instead to China or is used in the domestic market.

After pouring billions of dollars into new fab capacity over the years, Taiwan's total worldwide DRAM market share is roughly 11%, Floyd said. The island is expected to boost its DRAM market share to about 24.8% by 2000, based on the number of new fabs coming on line this year and next, according to projections made earlier this year by Vanguard International Semiconductor Corp., Hsinchu. Vanguard, one of Taiwan's largest DRAM makers, was named in Micron's complaint

techweb.com



To: DJBEINO who wrote (4225)11/7/1998 12:16:00 PM
From: DJBEINO  Respond to of 9582
 
Why Siemens is exiting the chip business -- Enough already
Richard Richtmyer

Siemens has had enough.

After investing heavily in its DRAM fabs and then losing more than $700 million in the chip business last year, the German electronics giant said last week that it will spin off that unit, as well as its other electronic-component segments.

The plan to spin off the businesses, outlined in Munich last week by Siemens AG president and chief executive Heinrich von Pierer, was motivated by the enormous capital requirements and huge profit fluctuations that are common for commodity-chip makers.

The move is also part of a broader 10-point reorganization scheme the company unveiled in July, designed to better focus the $70 billion conglomerate.

"It makes sense to try to rationalize the business," said Anita Farrell, an analyst with Merrill Lynch & Co. Inc. in London. "It's too big and too diverse."

Although it identifies itself as an electronics company, Siemens is a global in-dustrial conglomerate whose business lines include power plants, information and communications, health care, and transportation, as well as consultation, engineering, and integration services.

"It's a very large company. And it's been, in some ways, rather unfocused," Farrell said. "And certainly the losses this year have spiraled because of the DRAM business. So they made a decision not to remain there."

And those losses came shortly after Siemens spent a lot of money beefing up its DRAM capacity around the world.

In 1996, as the memory market began softening and other chip makers started to retreat from DRAMs, Siemens embarked on a capacity-expansion tear. As its competitors slowed or halted production at their fabs, Siemens ramped up production at its Dresden facility, constructed a new fab in the United Kingdom, and launched DRAM joint ventures with Motorola Inc. in Virginia and Mosel-Vitelic Inc. in Taiwan.

"The surprising part about it is that over the past two years, they've invested quite a bit of capital in upgrading their facilities and trying to make a big push into getting more market share and becoming a leading force in the DRAM industry," said analyst Jim Feldhan of Semico Research Corp., Phoenix.

But von Pierer conceded that the industry's latest cycle-perhaps the most punishing in history-has taken its toll.

"The semiconductor business is marked by high yet unsteady growth, with huge fluctuations in earnings," he said. "This has a major impact on our company's overall results."

Indeed, the semiconductor unit posted a pretax loss of $723.1 million, compared with a $65.7 million profit last year, the company reported.

The businesses in Siemens' components division, consisting of semiconductors, passive components and electron tubes, and electromechanical components, amassed combined sales of roughly $6.6 billion and employed about 47,000 during the recent fiscal year, which ended Sept. 30.

Those business groups, von Pierer said, will first be converted into separate legal entities. Then the semiconductor group, and possibly the passive-components and electron-tubes group, will be listed on a public stock exchange.

For the electromechanical group, the company is seeking a strategic partner, according to von Pierer.

Of the business groups that will be affected by the divestment plan, all but the semiconductor group were profitable during fiscal 1998.

Also, von Pierer said, several non-memory segments of the group have performed well.

"In a number of areas-such as high-frequency ICs and power semiconductors-[the group] has a leading market position and generates value for the company," he said. "The business with chip-card ICs is also strong. In the sector of memory chips, Semiconductors is among the world leaders in costs and product quality."

When pressed for more details about how the spun-off semiconductor unit will be structured, or if Siemens is considering strategic partnerships, company executives deferred comment until Siemens' analysts' meeting next month.

Siemens' decision comes as the latest in a line of semiconductor divestitures over the past several years, and given the current direction in which the semiconductor market seems to be headed, Semico's Feldhan said, it makes sense to spin the unit off now.

"If you look at it from a broader perspective, a number of semiconductor companies have repositioned themselves," he said. "Texas Instruments, for example, divested themselves out of the DRAM business. They've divested 12 different business units and are refocusing that company into DSP and analog."

National Semiconductor Corp. last year sold off Fairchild Semiconductor, a company it created in 1996 to concentrate on its older, commodity-product lines.

The Siemens divesture "is surprising because we hadn't heard any rumors about it," Feldhan said. "But when you do hear about it, it's not all that surprising that they're being repositioned. After a couple of bad years, companies start to look at how they can spin things off to set the stage for the next growth."

Many research firms, Semico included, expect to see a turnaround in the semiconductor market and some DRAM shortages starting sometime during the second half of 1999. And since Siemens said it expects the initial public offering to take at least 12 months to complete, "from the longer perspective, it may be a good time to do it and reap the appreciation over the next 24 to 36 months," Feldhan added.

Meanwhile, executives at Siemens' passive-components and electron-tubes group-which is also expected to go public in about a year's time-contend the divestiture will put the company in a better position to gain share in the commodity passive-components market.

For about three years, the passives group, which has a joint venture with Japan's Matsushita, has been building up capacity in an effort to become a larger player in the commodity passive-components market outside Europe.

"We see this as a great opportunity for us," said Denny Salmang, chairman and chief executive of Siemens Passive Electronic Devices Inc., South Iselin, N.J.

Being freed from its corporate parent, the company will be able to reinvest more of its profits, which Salmang said is the key to its expansion plan.

"We'll also have access to money which comes from the general market, which is normally cheaper than money you can get outside, and that will make it easier for us to make acquisitions," he added.

---

Siemens' DRAM Journey: A Time Line

- May 1996: Announces $1.5 billion 64-Mbit DRAM fab plan for Richmond, Va., in joint venture with Motorola Inc.

- October 1996: Forges strategic alliance with Mosel-Vitelic Inc. and enters into joint venture to build $1.7 billion fab in Taiwan.

- July 1997: Accelerates development of its embedded DRAM technology, moves toward 0.25-micron CMOS process from 0.35-micron, 64-Mbit DRAM process.

- September 1997: Christens new 0.35-micron fab in North Tyneside, England; extends partnership with Mosel-Vitelic.

- August 1998: Begins phasing out production at

North Tyneside fab, plans to shutter plant by

year's end.

- November 1998: Announces spin-off of semiconductor group and other businesses in components division.

techweb.com