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Technology Stocks : TAVA Technologies (TAVA-NASDAQ) -- Ignore unavailable to you. Want to Upgrade?

To: RAVEL who wrote (24647)	11/9/1998 9:03:00 AM
From: jwk	Read Replies (1) \| Respond to of 31646

RAVEL -- Given the way things have been going, when news of this partnership hits the market TAVA longs will probably be punished with at least a 1/4 pt. drop! 80}

To: RAVEL who wrote (24647)	11/9/1998 9:26:00 AM
From: Dorine Essey	Respond to of 31646

Sorry, meant this for the DELL thread. Dorine IRVINE, Calif., Nov. 9 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC) and Kingston Technology Company today announced the first shipment of Toshiba's Direct Rambus(TM) RIMM(TM) modules to Dell Computer Corporation (Nasdaq: DELL). TAEC and Kingston Technology are partnering to design, manufacture, and deliver leading-edge Rambus(TM) RIMM modules to PC OEMs planning shipment of systems using the Direct Rambus memory architecture in 1999. (Please refer to the partnership press release dated November 9, 1998.) RIMM modules achieve a maximum bandwidth of 1.6 gigabytes (GB) per second, double that of today's PC100 DIMMs; this dramatically boosts system performance. Stephen D. Marlow, vice president for business development, memory business unit at TAEC said, "We are very happy with the speed and smoothness that characterized our RIMM module development program. Our Direct Rambus experience with Kingston has been very productive in a short period." Toshiba produced the Direct Rambus devices used on the RIMM modules at its Yokkaichi fab in Japan. The Direct Rambus DRAMs were shipped directly to Kingston's Asia-Pacific Manufacturing Center in Taiwan and to Kingston's Americas Manufacturing Center in California to complete the module manufacturing process. Kingston worked closely with its Printed Circuit Board (PCB) suppliers to re-engineer their PCB manufacturing processes and process controls to achieve high yields of Direct Rambus specification-compliant PCBs. Direct Rambus RIMM module PCBs must meet tight impedance specifications, in order to allow PCs to reach the maximum peak bandwidth of 1.6GB per second. The joint effort to achieve high PCB yields by mid-1999 will quickly ramp down the additional costs associated with these new PCBs. The Kingston-supplied RIMM module PCBs were evaluated by Rambus Inc. According to Allen Roberts, vice president and general manager of Rambus' memory technology division, "Quality and performance are critical attributes in enabling the Direct Rambus architecture in 1999. Kingston is developing an infrastructure to mass produce RIMM modules and Rambus is helping to ensure that our specifications can be met in the high-volume market." Rambus subjected the Kingston-provided PCBs to rigorous tests, including impedance measurements, to verify compliance and performance. The Kingston PCBs used for the RIMM modules passed all PCB tests successfully. Roberts added, "We are excited to see that the Direct Rambus PCB specifications can be met by a major memory products manufacturer like Kingston, and that the PCB suppliers already have the capability to produce compliant boards." Kingston tested the Direct Rambus RIMM modules with its reference Hewlett- Packard HP83000(TM) testers. According to Steven Chen, Kingston director of technology, "Use of these testers allows the modules to be tested in an environment similar to actual system usage." Kingston tested the RIMM modules on an HP83000 F1300, which can test the RIMM modules at-speed or at 800MHz. The Kingston-built RIMM modules passed all HP83000 F1300 tests successfully. The tested RIMM modules were then approved for shipment to PC OEM customers. Toshiba completed its first shipment to Dell in mid-October and additional shipments of RIMM modules will be ongoing. According to Intel Corporation, Direct Rambus-enabled personal computers will reach new pinnacles of system performance. Toshiba delivered the industry's first functional Direct RDRAMs to Intel for evaluation in June, adding another achievement to its history of Rambus leadership. Toshiba was among the first semiconductor manufacturers to license Rambus technology. TAEC demonstrated the industry's first RDRAM working silicon in June 1992 and followed with the first Rambus-based multimedia systems using Toshiba RDRAMs and ASICs in 1993. Toshiba America Electronic Components, Inc. Toshiba America Electronic Components, Inc. (TAEC) is the North American design, manufacturing, marketing and sales arm of Toshiba Corporation, one of the world's largest suppliers of semiconductors, integrated circuits and electronic components. TAEC offers one of the broadest IC product lines in the industry as well as technologically-advanced electron tubes and solid state devices, including color picture tubes, color display tubes, liquid crystal displays, rechargeable batteries, microwave components, laser diodes and optical transmission devices. In addition to its comprehensive offering of high quality components, the company markets a wide range of industry standard 2.5-inch hard disk drives, CD-ROM drives and DVD-ROM drives. The company is located at 9775 Toledo Way, Irvine, CA 92618-1811. For more company information, please visit TAEC's Internet home page at: toshiba.com.