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Technology Stocks : Rambus (RMBS) - Eagle or Penguin -- Ignore unavailable to you. Want to Upgrade?

To: REH who wrote (9378)	11/10/1998 9:07:00 AM
From: REH	Read Replies (2) \| Respond to of 93625

SMART MODULAR TECHNOLOGIES, INC. ANNOUNCES AVAILABILITY OF RAMBUS RIMM MODULES 64MB & 128MB Direct Rambus RIMM Modules Direct RDRAM Devices Will Provide a Peak Bandwidth of 1.6gb/Second SMART Participates in Rambus Validation Program to Ensure System and Component Compatibility FREMONT, Calif., Nov. 10 /PRNewswire/ -- SMART Modular Technologies, Inc. (Nasdaq: SMOD) announced today that it has begun sampling 64MB and 128MB Direct Rambus(TM) RIMM(TM) memory modules. The RIMM modules are manufactured with Direct RDRAM(TM) devices and run at a speed of 1.6 GB per second of peak bandwidth, the memory industry's highest speed. The RIMM modules will assist SMART's OEM customers in developing and testing next-generation system platforms. "As one of our established partners and a memory module industry leader, we see SMART as key to the launch of Direct Rambus RIMM modules in the marketplace," said Allen Roberts, Rambus' Vice President and General Manager of the Memory Technology Division. "SMART's expertise in design and test are critical to an OEM's successful implementation of Rambus(R) modules into their systems and we are pleased to know that the company has already commenced sampling," he continued. Rambus RIMM modules provide three times the memory system performance of today's SDRAM modules. Key applications for RIMMs include personal computers, workstations and servers. The increasing popularity of Rambus technology is reflected in forecasts provided by Cahners In-Stat Group, which expects demand for Rambus DRAM devices to grow at a Compound Annual Growth Rate (CAGR) of 141% to 2193 million devices by the year 2002. "Direct Rambus RIMM memory modules will play a significant role in the future design of PCs, servers and workstations requiring high-speed throughput," stated Bill Johnston, SMART's Vice President of Marketing. "Similar to our participation in Intel's PC100 Validation Program for the launch of PC100 modules, SMART continues to participate in the Rambus Validation Program to ensure system and component compatibility for maximized speed," continued Johnston. SMART's Direct Rambus memory modules will incorporate Micro Ball Grid Array/Chip Scale Packaging (micronBGA(R)/CSP) technology. In order to minimize cost and maximize yield, SMART uses specialized surface-mount equipment to assemble modules. For high-quality production, SMART has also implemented advanced x-ray equipment to check solder connections and to conduct 100% inspection accuracy of the double-sided RIMMs. This system of examination applies multiple x-rays at different angles to allow for thorough inspection of top and bottom devices. SMART recently incorporated advanced test systems to ensure full-speed functionality and high-quality Direct Rambus memory modules. SMART's advanced test systems are capable of testing up to 1.3 GHz with a measuring accuracy of +/- 50ps.