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Technology Stocks : INVX Innovex Comdex Winner !! -- Ignore unavailable to you. Want to Upgrade?

To: Douglas V. Fant who wrote (2765)	11/15/1998 1:57:00 PM
From: Douglas V. Fant	Read Replies (1) \| Respond to of 3029

t723a, If Mr. Keller of INVX is not familiar with Adflex, I bet his lower level operational people are... Here's an announcement from last May when Adflex and FCT joined to research a 25% smaller pitch on its wafer bumps.... Flip chips are up to 95% smaller than traditional semiconductor chips, and are more functional to boot. Now you can see why they are of interest to cell phone, pager manufacturers, networkers, the defense industry, measurement equipment industry, as well as manufacturers of laptops, palmpilots,etc... Also go to: flipchip.com That is Flip Chip Technologies Homepage. FCT now is not a competitor of FLX, SFLX, or INVX. Instead FCT provides components to the flip chip/flex circuit manufacturers and assemblers.... ADFLEX SOLUTIONS TO TEAM WITH FLIP CHIP TECHNOLOGIES TO ADVANCE FLEX DESIGN AND ASSEMBLY CAPABILITIES CHANDLER, Arizona (May 12, 1998) — ADFlex Solutions, Inc. (Nasdaq NM: AFLX) today announced that it has teamedwith Flip Chip Technologies, L.L.C. (FCT) to develop fine pitch solutions to address evolving technical needs in the computer,communications, and consumer electronics industries. According to the companies, the joint program is expected to demonstrate a 25% reduction in current bump pitch to allow significant cost reductions in future silicon and flex circuit products. The companies also anticipate that the use of flip chip will promote gains in electrical performance, profile-size reductions, and decreased manufacturing and product costs. The effort will focus on advancing flexible circuit substrate and assembly technology employing the combined synergies of ADFlex's one-stop shop capabilities, and FCT's proprietary flip-chip bumping and wafer processing services. Said Rolando C. Esteverena, ADFlex President and Chief Executive Officer, "This alliance we believe is very positive for ADFlex, FCT and our customers. This is a relationship that enhances our one-stop-shop capability. We already offer OEMs significant advantages of a single-source service for design, development and volume manufacturing of both flexible circuits and component assembly technologies. The ability to extend this service to include device bumping in conjunction with FCT will bring further efficiencies in product development cycles, technical capabilities and production costs." ADFlex believes the effort will ultimately bolster its position as a leading single-source worldwide supplier service in flex circuitry design, production and assembly. Said Harry Hollack, FCT President and CEO, "We are very excited about this collaborative effort to address the evolving needs of our customers by taking advantage of the respective capabilities of our two organizations." "The approach we are taking in this effort is consistent with our mission statement to be the world's premier wafer bumping resource through customer satisfaction and leading edge technology. Ourpartnering with ADFlex is an example of our commitment to be at the leading edge of technologies through establishing relationships to better service the needs of our customers." ADFlex has developed fine pitch flexible circuit technology specifically to support flip chip. The company plans to further enhance fine pitch in single and double sided flex circuit processes and flip chip assembly technologies with the aid of advanced bump technology provided by FCT to produce highly cost effective and reliable products. In the joint effort, FCT will provide solder bumping for a variety of fine pitch peripheral and array footprints which specifically address next generation Flip Chip-On-Flex (FCOF) requirements. The program will focus on defining qualifying factors that enable high yield assembly. This system level approach will determine the most effective devices and substrate layouts with respect to solder bump sizes, I/O placements and assembly processes. The program is expected to provide an extremely rugged and reliable assembly. ADFlex Solutions, Inc. is a leading supplier of flexible circuit-based interconnect solutions to the computer, computer peripheral, communication and other industries. Applications for flex-based interconnects include cellular telephones, hard disk drives and other storage systems, high-end consumer products, notebook computers, pagers and personal communications systems. FCT is an innovative, high-volume wafer bumping resource providing services and expertise to the semiconductor industry based on proven technology. A joint venture of Delco Electronics and Kulicke & Soffa Industries, FCT is an ISO 9002 and QS 9000 certified company formed in 1996 to offer merchant bumping services used in applications requiring higher performance, reduced form factor and lower costs than available through traditional surface mount technologies. "Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: The statements contained in this release which are not historical facts may contain forward-looking statement that involve risks and uncertainties, including, but not limited to, the success of ADFlex's collaborative efforts with FCT, and whether such efforts will bolster the Company's position as a leading flex supplier, and other risks detailed in the Company's annual report on Form 10-K for the year ended December 31, 1997.