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Technology Stocks : ESST-the new beginning. -- Ignore unavailable to you. Want to Upgrade?

To: Richard Makowiec who wrote (2131)	11/16/1998 12:34:00 PM
From: Steve Reinhardt	Respond to of 3493

ESS's stock price, in my opinion, will try to break $6.50 and try for $8.00 in the next two weeks or three. It will face resistence at $8 to $8.50. I think the small investors with 500 share to 5k share will come back in this time. This is why the stocks will try for higher value instead going lower to $4 to $4.50. Unlike last time after the Nov. 12 press release, that was mostly due to 10k share or more buyers. Let's analyse the press release for today. What is missing is the AMR(audio modem riser card) from the press release. AMR is becoming a very important check point for customers. What's advantageous to ESS is that it does not have a existing modem market share to protect, unlike Rockwell, Lucent and T.I. ESS can do whatever it sees as the best strategy to position its DSP and HSP modem against its competitions. It also has the first class audio to combine with to address the PC market needs. In all, the modem is still a worthwhile core competency that ESS posseses that is going to pay off its long term investments. Steve ESS Technology Introduces V.90 PCI Audio/Modem Combo Solutions; SuperLink Products Achieve Higher Throughput and Faster Connect Speeds FREMONT, Calif., Nov. 16 /PRNewswire/ -- ESS Technology, Inc. (Nasdaq: ESST - news), a world leader in PC audio, introduces its V.90 SuperLink[tm] products for audio/modem, combo solutions. ESS offers two versions of this new technology - both digital signal processing (DSP) and host signal processing (HSP). These products are designed to meet next-generation PC requirements for highly integrated solutions that combine high performance and low cost. In addition to industry-leading high performance audio, these audio/modem chipsets provide 56kbps (V.90) data, fax, and voice PCI solutions for notebook, desktop and add-in card applications. The HSP-based solution incorporates a digital audio accelerator, an audio codec and a modem codec, while the DSP-based solution includes a high performance DSP to offload the host CPU and increase overall system performance. Both chipsets feature 500 MIPS equivalent processor performance to accelerate multi-stream PC audio and 64-channel Wave Processor for DirectSound(R) and/or wavetable applications. ESS' V.90 combo solutions are compatible with Microsoft's(R) PC98/99, DirectSound and Direct3Dsound(R) standards. ''ESS has the only audio/modem combo solution that gives the manufacturer the flexibility to provide either an HSP or DSP-based modem as a plug-in option, enabling a 'build to order' capability,'' states Mark Klonower, Director of Product Development for ESS Technology. ''You can easily combine a modem codec chip with our audio chip and do the modem processing on the CPU, creating the highest performance, lowest cost modem solution available.'' SuperLink[tm] Test Results ESS Technology's audio/modem chipsets have been tested by Henderson Communications Laboratories, the international leader in data, PCM, Fax, Cellular, ISDN and xDSL testing. When compared to modems from other modem suppliers including Lucent, Rockwell and US Robotics, the ESS audio/modem chipsets - both DSP and HSP - ranked the highest in both connect speed and throughput compared to all other modems tested by Henderson. PCI Audio/Modem Solutions The heart of both the DSP and HSP chipsets is ESS Technology's Maestro-2EM[tm] digital audio accelerator. The Maestro-2EM features include full ACPI support, a hardware wavetable synthesizer with Downloadable Samples (DLS) and complete DirectSound 3D acceleration, ESS' proprietary technology in the Maestro-2EM supports Microsoft(R) Windows(R) PC98 and PC99 logo requirements, and has 100% DOS game compatibility. The Maestro-2EM's 500 MIPS processor accelerates multi-stream PC audio while the on-chip PCI bus arbitration circuitry provides three additional PCI bus masters. The Maestro-2EM also features S/PDIF Out for digital audio and MIDI, and an EEPROM interface for subsystem vendor identification.