SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : Speedfam [SFAM] Lovers Unite ! -- Ignore unavailable to you. Want to Upgrade?


To: Mr. Sam who wrote (3250)12/1/1998 1:08:00 AM
From: SteveC  Respond to of 3736
 
Maybe this is wishful thinking, but this is the first article I've seen in a long, long time discussing an impending shortage of capacity in the industry. From CMP's website:

Wafer Capacity Could Fall Short
In 2000
(11/30/98, 8:07 p.m. ET)
By Staff, Semiconductor Business News

Third-party wafer-foundry capacity could end up in
short supply by the year 2000 if chip manufacturers
increase their use of contract manufacturing, said a new
report from Semico Research in Phoenix.

Currently, there is a glut of silicon-foundry capacity, but
Semico said that condition could quickly change if
major semiconductor makers decide to shift more of
their wafer processing to third-party fabs at a time when
chip markets begin recovering from the current slump.

The Phoenix market researcher estimated that demand
for processed wafers is increasing at a compound
annual growth rate of 13 percent over the next five
years. Silicon-foundry demand is expected to grow at
21 percent in the five-year period.

Today, fab-operating chip suppliers -- known as
integrated-device manufacturers, or IDMs -- get about
5 percent of their processed wafers from foundries,
according to Semico's report. If IDMs increased their
use of foundries to about 10 percent of their processed
wafer, the silicon-foundry business could grow 40
percent, which would lead to a potential shortage of
capacity in 2000, the report said.

A number of major IC manufacturers are planning to
increase their use of outside foundries as part of a
restructuring of their business models and a hedge
against uncertain times. Motorola, for example, intends
to get 30 percent of its chips from third-party foundries
by 2000 compared to just 7 percent last year. In four
years, Motorola wants to move 50 percent of its
wafer-processing needs to outside foundries.



To: Mr. Sam who wrote (3250)12/1/1998 2:51:00 PM
From: blake_paterson  Read Replies (1) | Respond to of 3736
 
Mr. Sam: What do you make of the recent Intel PR re: limiting capex to 0.18mm technology buys? eg.:

businessweek.com

Excerpt:
<<Intel is looking for even bigger savings in production costs. It is accelerating by six months, to mid-1999, its move to next-generation chip manufacturing technology: Shrinking the width of circuits on chips from 0.25 microns--about one-four-hundredths of the thickness of a human hair--to just 0.18 microns. That lets Intel make 75% more chips per silicon wafer, dramatically slashing its unit costs. And instead of buying all-new production gear, the company plans to reuse 70% of its current equipment as it shifts to 0.18-micron widths. These and other moves should raise gross profits by more than $1 billion in 1999.>>

Does it change your outlook for SFAM? TIA,

BP