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To: Jim Oravetz who wrote (9870)11/24/1998 10:15:00 PM
From: Dale Knipschield  Read Replies (2) | Respond to of 11555
 
Info on Winchip....

realworldtech.com

See last paragraph of 11/21/98 news and 1st paragraph of 11/10 news...

Regards,

Knip



To: Jim Oravetz who wrote (9870)12/12/1998 11:26:00 PM
From: Jim Oravetz  Read Replies (1) | Respond to of 11555
 
I came across this comment from the chief technology officer at IDT.
This came from an article in the Semiconductor Business News, Dec '98
issue. The article was mainly about how IC geometries are moving towards .18 micron faster than expected. Many of the companies mentioned were the really big boys -- IBM, Intel, Siemans etc. Surprise, surprise, IDT gets some press in a article on leading edge IC fabrication. The way they totally failed to produce a decent speed WinChip, IMHO they are falling further and further behind the competitive curve in the uP area. Maybe they are having better luck with the shrink of the devices in the SRAM/FIFO area, where the # of transistors is lower??

For those interested in the rest of the article, try
www.semibiznews.com/pub/1298/feat18.htm

+++++++++++++++++++++++++++++++
But regardless of what chip makers call their technologies, they are now pushing hard to reduce device feature sizes and stay at the leading-edge of wafer processing. "In CPUs, you must keep up with Intel," observed Chuen-Der Lien, chief technology officer at Integrated Device Technology Inc. in Santa Clara, Calif.

"In SRAMs," the IDT executive said, "you must make sure you are ahead of the foundries in Taiwan, which are now producing many of these parts." IDT plans to move its 0.18-micron technology from R&D to production early in the second quarter in 1999. According to that schedule, it will take IDT just one year of development to launch its 0.18-micron technology.