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To: MileHigh who wrote (62)	11/30/1998 8:52:00 AM
From: Thomas C. Donald	Respond to of 236

Top DRAM and Computer Systems Suppliers Support Double Data - Rate Memory 11/30/98 Business Wire (Copyright (c) 1998, Business Wire) SAN JOSE, Calif.--(BUSINESS WIRE)--Nov. 30, 1998-- Open, JEDEC-Approved Memory Standard Offers Cost-Effective High-Bandwidth Performance Providing Ease of Migration, Simplified Design for Today's Applications Eleven dynamic random access memory (DRAM) chip suppliers today announced their support for the development and manufacture of Double Data Rate (DDR) synchronous DRAM (SDRAM) memory components and modules. DDR SDRAM is an open standard developed and approved by the Joint Electronic Device Engineering Council (JEDEC) of the IEEE. The DDR specification addresses the high data throughput requirements demanded by the industry's dramatic increases in microprocessor speeds. This new memory standard is ideal for today's servers, workstations, personal computers, data communications, and consumer products in which performance parity with the microprocessor is critical. The eleven companies supporting this initiative are Fujitsu, Hitachi, Hyundai, IBM, LG, Micron, Mitsubishi, NEC, Samsung, Siemens, and Toshiba. Today, Silicon Graphics also announced support for system designs using DDR SDRAM technology. See related SGI announcement this date and IBM quote below. Recent Industry Forums Demonstrate Broad Support At a recent, unprecedented series of sponsored DDR technical forums in Silicon Valley, attended by over 50 major computer system and supporting technology companies, presentations from system design leaders clearly stated the technical and business reasons why DDR could become the next widely adopted DRAM technology. Support for DDR SDRAM with clear product introduction plans was also demonstrated by memory enabling technology leaders including logic, clock control and connector companies. For details go to http//www.hpl.hp.com/hosted/mtc/ What people are saying: "An industry-wide push for DDR is crucial to its adoption," said Jim Handy, director and principal analyst at San Jose market researcher Dataquest. This demonstrates the industry's seriousness about this technology." "DDR SDRAM offers immediate advantages in terms of performance and cost for applications that require large memory configurations or that require an evolutionary range of performance from 66MHz to 200Mhz," said Bert McComas, principal at market research firm Inquest, Gilbert, Ariz. "This criteria applies to servers, workstations and data communications. Many other applications can just as easily benefit from this continuity and flexibility." "At a minimum, DDR SDRAM can capture a respectable 12 to 17 percent of DRAM demand by mid-2000, " said Victor de Dios, president of De Dios and Associates, a Newark, Calif.-based semiconductor market research firm. "Demand can increase substantially beyond that level as the market realizes its cost-performance advantages versus more costly alternatives. DDR also offers less risk for both computer and DRAM manufacturers in this uncertain time." "The emerging DDR technology provides improved performance (double bandwidth) while minimizing changes to existing system designs," said Vijay Lund, director of advanced server engineering, IBM. "DDR includes reliability features -- such as improved error-correction -- that allow us to build systems with high availability. The efforts of JEDEC to define a common DDR specification gives us confidence that we will be able to accommodate future system requirements in performance and capacity in a cost-efficient manner." Technology backgrounder available upon request. CONTACT: JEDEC Desi Rhoden, 602/752-6323 desi.rhoden@vlsi.com or Marketing/PR Savvy Ford Kanzler, 650/726-1055 ford@prsavvy.com 07:30 EST NOVEMBER 30, 1998

To: MileHigh who wrote (62)	11/30/1998 8:56:00 AM
From: Thomas C. Donald	Read Replies (1) \| Respond to of 236

SMART Modular Technologies Announces the Development of 184-Pin Registered And Unbuffered Double Data Rate Modules 11/30/98 PR Newswire (Copyright (c) 1998, PR Newswire) High-Density Modules are JEDEC-Compliant Modules Provide Increased Performance for High-End PCs, Servers And Workstations FREMONT, Calif., Nov. 30 /PRNewswire/ -- SMART Modular Technologies, Inc. (Nasdaq: SMOD) announced today that it has begun development of 184-pin registered and unbuffered Double Data Rate Synchronous DRAM (DDR SDRAM) modules which use DDR SDRAM devices. Samples are expected to be available in the beginning of 1999. DDR is a clocking method that transfers data twice as fast as existing SDRAMs, doubling the data throughput. DDR SDRAM modules are targeted for use as the main memory for servers, workstations and high-performance PCs. "SMART continues to have the products available to meet the needs of their OEM customers," stated Sherry Garber, Vice President for Semico Research. "SMART's launch of DDR modules will assist its customers in maximizing the functionality of servers and high-end desktop PCs; a market we see growing at double-digit rates through 1999," she continued. "SMART incorporates its leading-edge module design, production and test expertise to support OEMs in utilizing state-of-the-art DRAM technology such as DDR," stated Arthur Sainio, SMART's Product Line Manager, Specialty Memory Division. "DDR module development is part of SMART's strategy to provide high-end PC, workstation and network server OEM manufacturers with low-cost memory solutions that offer high-bandwidth and advanced performance," continued Sainio. Double Data Rate technology is an evolutionary design emerging from the existing architecture of SDRAMs. The enhanced architecture encompassed in the DDR modules is a low-cost solution for applications that require high bandwidth or large amounts of memory. The transfer data rate of DDR components is 200Mbits per second, a bandwidth increase of 100% from the 100Mbit Single Data Rate (SDR) SDRAM (assuming 100MHz system bus speeds). This translates to 1.6 gigabytes per second at the module level. The modules will operate at 3.3V and will conform to the JEDEC DDR specifications with densities of up to 256Mbytes. DDR SDRAM modules will be manufactured utilizing SMART's high volume testing and manufacturing expertise to guarantee high-performance, high-quality products. SMART Modular Technologies, Inc. is a leading independent manufacturer of specialty and standard memory modules, Flash memory cards, high-performance embedded computer boards, as well as I/O product solutions. SMART offers more than 500 products to leading OEMs in the computer, networking, and telecommunications industries. SMART has manufacturing facilities in California, Puerto Rico, Scotland, and Malaysia, design centers in California and India, and sales organizations worldwide. More information on SMART can be obtained on the Internet at smartm.com. The first and fourth paragraphs of this press release contain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended. Actual results could differ materially from those projected in the forward-looking statements as a result of certain factors including without limitation material availability, production, engineering and/or technical problems in getting samples or production units of the 184-pin registered and unbuffered DDR SDRAM modules to market. /CONTACT: Arthur Sainio of SMART Modular Technologies, Inc., 510-624-8126, or asainio@smartm.com; or Jay Nichols of Sterling Communications, Inc., 408-441-4100, or jnichols@sterlingpr.com, for SMART/ 08:01 EST

To: MileHigh who wrote (62)	12/2/1998 9:27:00 PM
From: MileHigh	Respond to of 236

Wednesday December 2, 8:00 pm Eastern Time Company Press Release SOURCE: Teradyne, Inc. Teradyne Demonstrates Direct Rambus DRAM Testing at SEMICON/Japan TOKYO, Dec. 2 /PRNewswire/ -- Teradyne, Inc. (NYSE: TER - news) is demonstrating the high-speed memory test capabilities of its ARIES™ RAM test system at the SEMICON/Japan conference here this week. The demonstration features Toshiba's Direct Rambus™ devices to showcase ARIES' capabilities for engineering and production test of high-speed Direct Rambus DRAMs and SLDRAMs. Teradyne announced that the ARIES system has been selected by multiple DRAM manufacturers for test of Direct Rambus DRAMs. ''Even in a depressed DRAM market, leading manufacturers are making the investments required to ramp up volume production of the next generation Direct RAMBUS and SLDRAM devices,'' said Glenn Farris, ARIES product manager. ''These new high-speed memory architectures require full testing of the memory array through the logic interface at speed in order to achieve the fault coverage demanded by the PC main memory application. The ARIES system, which is equipped with at-speed full algorithmic pattern generation, deep vector memory, and redundancy analysis, was developed specifically to perform this complex testing without the need for pattern reloads, thereby delivering the highest throughput in production.'' Farris noted that ARIES shipments began in December 1997 and have been increasing steadily since then, as manufacturers move from engineering development into volume production of the fast memories. The ARIES RAM test platform tests up to 16 devices in parallel at data rates up to 1.0 G transfers/second, providing the lowest cost to test for the newest-generation devices such as Direct Rambus DRAMs, SLDRAMs, and fast SSRAMs, Farris said. Teradyne was selected by Rambus as a technology partner, and by the SLDRAM consortium as its reference standard test system. Teradyne is the world's largest manufacturer of automated test equipment (ATE) for the electronics industry. Products include systems to test semiconductors, circuit boards and modules, telephone lines, computerized telephone systems, and software. The Company is also a leading manufacturer of backplanes and associated high-density connectors used in electronic systems. Teradyne supports these products through an extensive service and application engineering network, with technical centers located throughout the United States, Europe, and the Pacific Rim. The ARIES memory test system is produced by the Memory Test Division in Agoura Hills, and San Jose California. Headquartered in Boston, Massachusetts, Teradyne reported sales of approximately $1.3 billion in 1997 and had 6,300 employees worldwide. The company's Web address is www.teradyne.com. ARIES is a trademark of Teradyne, Inc. Direct Rambus is a trademark of Rambus, Inc. SOURCE: Teradyne, Inc. --------------------------------------------------------------------------------

To: MileHigh who wrote (62)	12/2/1998 9:38:00 PM
From: MileHigh	Read Replies (2) \| Respond to of 236

Wednesday December 2, 8:00 pm Eastern Time Company Press Release SOURCE: Teradyne, Inc. Teradyne Demonstrates Multi-media Microprocessor Test on J973 System at SEMICON/Japan TOKYO, Dec. 2 /PRNewswire/ -- Teradyne, Inc. (NYSE: TER - news) is demonstrating its J973 VLSI system at the SEMICON/Japan conference here this week, testing AMD's K6®-2 processors with 3DNow!™ technology. Teradyne recently announced that its J973 VLSI Test Systems are playing a major role in production testing of K6®-2 devices at Advanced Micro Devices (AMD) in Texas and Singapore, and that the J973 will also be deployed at AMD's new fab in Dresden, Germany to test advanced microprocessors. In addition to PC microprocessors, the J973 system is also being used to test chipset devices with Direct Rambus™ interface, high-end microprocessors for servers and workstations, processor chips for consumer applications such as DVD and set-top boxes, and high speed ASICs. The J973 tests complex microprocessors with up to 1,024 pins, at data rates to 800 Mbits/sec. Its Pattern Integrator™ architecture interleaves memory, logic and scan patterns, to provide seamless testing of devices with high-speed interfaces as well as embedded memory and built-in self-test functions. J973 customers include Mitsubishi, NEC, AMD, Siemens AG, Texas Instruments, SGS-THOMSON, and Silicon Graphics, Inc. Teradyne is the world's largest manufacturer of automated test equipment (ATE) for the electronics industry. Products include systems to test semiconductors, circuit boards and modules, telephone lines, computerized telephone systems, and software. The Company is also a leading manufacturer of backplanes and associated high-density connectors used in electronic systems. Teradyne supports these products through an extensive service and application engineering network, with technical centers located throughout the United States, Europe, and the Pacific Rim. The J973 system is produced by the VLSI Test Divisions in Agoura Hills, and San Jose California. Headquartered in Boston, Massachusetts, Teradyne reported sales of approximately $1.3 billion in 1997 and had 6,300 employees worldwide. The company's Web address is www.teradyne.com. AMD-K6 and 3DNow! are trademarks of Advanced Micro Devices, Inc. Direct Rambus is a trademark of Rambus, Inc. Pattern Integrator is a trademark of Teradyne, Inc. SOURCE: Teradyne, Inc. --------------------------------------------------------------------------------