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To: Steven Messina,L.M.T. who wrote (20283)	11/30/1998 5:12:00 PM
From: BillyG	Respond to of 25960

Search for post-optical lithography continues at Sematech workshop semibiznews.com A service of Semiconductor Business News, CMP Media Inc. Story posted 4 p.m. EST/1 p.m. PST, 11/30/98 COLORADO SPRINGS, Colo.-- A group representing chip makers from around the world will meet here again next week in an attempt to reach consensus on the best candidates for photolithography after optical tools stop working. For three decades, optical lithography has been the standard exposure technique in wafer processing, but experts believe a new technology will be needed after feature sizes shrink below 0.10 micron. It remains unclear exactly when an alternative to optical lithography will be needed. Recent studies have indicated that it might be feasible to use 157-nm lasers to push optical lithography beyond 0.10-micron device feature sizes. During the first Next-Generation Lithography Workshop in November 1997, representatives concluded that four technologies were leading candidates: Extreme ultraviolet (EUV); X-ray; Lucent Technologies' SCALPEL (scattering with angular limitation projection electron-beam lithography); and, Ion-beam projection. Industry consortium Sematech is sponsoring efforts to narrow down candidates for post-optical lithography. Next week, about 120 experts from chip makers, fab equipment suppliers and research labs are expected to attend the Sematech workshop. Sematech's international subsidiary intends to narrow the options in 1999, and it hopes to advocate a single technology in 2000. "The industry is progressing to making this very important decision," said Gerhard Gross, director of lithography for International Sematech, based in Austin, Tex. "We will look at critical issues surrounding technology, infrastructure, timing, cost and productivity to make the identification of viable options for continued consideration."