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To: orkrious who wrote (20287)	12/1/1998 11:08:00 AM
From: BillyG	Read Replies (2) \| Respond to of 25960

Canon's ArF stepper for 0.13 micron converts to 300-mm semibiznews.com A service of Semiconductor Business News, CMP Media Inc. Story posted 9:30 a.m. EST/6:30 a.m. PST, 12/01/98 SANTA CLARA, Calif -- Canon U.S.A. Inc.'s Semiconductor Equipment Division here today announced the introduction of the Canon ArF excimer laser scanning stepper. The new argon fluoride scanner, the FPA-5000AS1, is capable of realizing 0.13-micron linewidths for 1-gigabit or higher DRAMs and 1-gigahertz-class microprocessor process development on either 200-mm or 300-mm wafer substrates. The ArF scanning stepper has the same platform as the dual-era FPA-5000ES2 KrF excimer laser scanning stepper which Canon introduced recently for volume production. The platform allows easy field conversion from 200-mm to 300-mm wafers with a simple conversion kit. The flexible wafer capability of the FPA-5000AS1 gives chip makers dual, extended value from their investment by spreading the outlay across both their 200-mm and their 300-mm programs. They can equip their R&D teams for work on 193-nm process evaluations down to 130 nm in an existing 200-mm facility, then convert the tool for 300-mm service when practical. For 193nm wavelength exposures, the FPA-5000AS1 uses a new reduction projection lens and illumination system. These 193-nm optics incorporate high-purity calcium fluoride elements and aspherical surfaces to provide high-contrast imaging and extremely low distortion. Canon will ship its first system to Japan's Selete (Semiconductor Leading-Edge Technologies Inc.) consortium in a few months. Orders are being taken for the new ArF system for a limited time and Canon has scheduled deliveries worldwide by the second quarter of 1999.