Some copper/0.18 mumeter news
(BW)(NOVELLUS-SYSTEMS)(NVLS) Novellus Ships Multiple SABRE and INOVA Systems; Damascus Complete Copper Systems Now Seeded in Fabs on Three Continents
Business Editors and Computer Writers
SAN JOSE, Calif.--(BUSINESS WIRE)--Dec. 1, 1998--Less than six months after launching its new Damascus(TM) toolset, Novellus Systems Inc. (Nasdaq: NVLS), the productivity and innovation leader in thin film deposition, today announced the delivery of multiple SABRE(TM) electrofill and INOVA(TM) physical vapor deposition (PVD) systems to a number of leading chipmakers across North America, Asia and Europe.
These systems are the backbone of Damascus(TM) Complete Copper(TM) -- a full spectrum of equipment and processes designed to enable advanced, production-worthy copper interconnect structures in next-generation semiconductor devices. The manufacturers purchasing these tools are expected to use them to produce dual damascene copper structures with geometries below 0.18 micron.
According to Novellus' Metals Business Group Executive Vice President John Chenault, the fact that industry-leading logic manufacturers have chosen to implement copper interconnect programs in their fabs so soon after the Damascus program roll-out signals its importance to the semiconductor industry. "These SABRE and INOVA shipments verify the rapidly building momentum to transition to copper interconnects -- with Damascus fueling a new round of technology innovation in the industry," said Chenault. "In addition, the success of our Damascus solution has enabled us to weather the current economic downturn more successfully than many of our competitors."
"The demand for copper dual damascene systems is escalating," continued Chenault. "The semiconductor industry is on the cusp of the most fundamental technology change it has experienced in the last 20 years. Novellus has taken a leadership role in the copper arena and pioneered efforts to help chipmakers expedite their move to this copper processing technology."
SABRE systems were selected as the result of competitive evaluations in which Novellus tools demonstrated superior technical performance and productivity. SABRE was judged the optimal production solution for copper electrofill, with the productivity, throughput and reliability needed for volume manufacturing. Its proprietary bath chemistry and chemistry control enable high-quality, void-free copper fill in extremely deep, narrow trenches (6:1 ratio). In addition, SABRE features a unique cell design that ensures superior reproducibility of the copper fill--with a within wafer film uniformity of <5 percent, 3 sigma. The system's unique wafer contact scheme eliminates backside contact with the plating bath during the electroplating process, preventing backside copper contamination.
The INOVA PVD system is equally critical to the dual damascene process. INOVA's proprietary, breakthrough 3-Dimensional, Hollow Cathode Magnetron (HCM(TM)) source technology is at the heart of the system. It provides the uniformity and conformality needed to apply PVD films such as advanced Ta(N)/Cu barrier/seed applications for copper interconnects, as well as Ti/TiN liner/barrier layers for tungsten plug and aluminum fill. It delivers superior bottom and sidewall coverage in aspect ratios >6:1. Additionally, the system has demonstrated its ability to deposit the seed layer required for a void-free electrofill process in up to 6:1 aspect ratio dual damascene structures. Novellus' electroplating experience shows that the HCM technology extends the electrofill process to higher aspect ratios and smaller via diameters, as compared to other ionized PVD barrier/seed processes.
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: The statements regarding (i) the uncertainty surrounding the semiconductor capital equipment industry, (ii) the Company's ability to control certain expenditures, (iii) the long-term growth prospects for the thin film deposition market, (iv) the Company's ability to lead market transitions in sub-0.35 micron and dual damascene copper processing, (v) the anticipated growth resulting from investment in new product development, (vi) the introduction of dual damascene copper processing products, and (vii) the Company's ability to continue to invest in new product development, as well as other matters discussed in the news release that are not purely historical data, are forward-looking statements. The forward-looking statements involve risks and uncertainties including, but not limited to, a possible continuing slowdown in new orders and the inability of the Company's product development efforts to continue its position as an industry leader in deposition technologies, and other risks indicated in filings with the Securities and Exchange Commission (SEC). Actual results may differ materially. Novellus assumes no obligation to update this information. For more details, please refer to Novellus' SEC filings, including its most recent Annual Report on Form 10-K and quarterly reports on Form 10-Q.
About Novellus Systems
Novellus Systems Inc. manufactures, markets and services advanced automated wafer fabrication systems for the deposition of thin films. Novellus deposition systems are designed for high-volume production of advanced, leading-edge semiconductors at the lowest overall cost. Headquartered in San Jose, Calif., with subsidiaries in the United Kingdom, France, Germany, the Netherlands, China, Japan, Korea, Singapore and Taiwan, Novellus is a publicly traded company on the Nasdaq stock exchange (Nasdaq: NVLS). Additional information about the company is available on Novellus' home page on the World Wide Web, located at novellus.com |
