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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: blake_paterson who wrote (26849)	12/3/1998 9:26:00 AM
From: blake_paterson	Respond to of 70976

( BW)(FSI-INTERNATIONAL)(FSII) FSI International Ships Order for Copper CMP Application to Texas Instruments Business Editors MINNEAPOLIS--(BUSINESS WIRE)--Dec. 3, 1998--FSI International (Nasdaq: FSII) announced today that it has begun to ship an order for multiple P4400 slurry blending and distribution systems and turnkey services to Texas Instruments Inc. (TI). The systems are being installed in TI's semiconductor manufacturing facilities in Dallas, Texas. The systems will support a copper chemical-mechanical polishing (CMP) program at TI's R&D/production facility and oxide slurry applications in its DFAB1. TI, the world's leading producer of analog chips, will also use FSI equipment to distribute slurry for Shallow Trench Isolation (STI) CMP, a relatively new wafer manufacturing process that can reduce process steps and increase yields. FSI P4400 systems are available in several configurations that can blend and distribute oxide, tungsten, copper or polysilicon CMP slurry. The design features patented vacuum-pressure technology that delivers slurry to the CMP polishers, and preserves the slurry quality by preventing particle agglomeration that can cause scratches on the silicon wafer. FSI International, Inc. is a leading global supplier of processing equipment used at key production steps to manufacture microelectronics, including semiconductor devices, thin film heads, flat panel displays and multichip modules. The company develops, manufactures, markets and supports products used in the technology areas of microlithography, surface conditioning and chemical management. FSI International's customers include microelectronics manufacturers located throughout North America, Europe, Japan and the Asia-Pacific region. Additional information on FSI International can be obtained by accessing its homepage at fsi-intl.com.