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To: TI2, TechInvestorToo who wrote (20332)12/7/1998 10:47:00 PM
From: BillyG  Respond to of 25960
 
Korea okays use of loans to help restructure industry
semibiznews.com

A service of Semiconductor Business News, CMP Media
Inc.
Story posted 12:45 p.m. EST/9:45 a.m. PST, 12/7/98

By Jack Robertson

WASHINGTON -- The South Korean
government today agreed to let the debt-laden
chaebols convert some of the huge domestic bank
loans into equity as part of a sweeping industry
restructuring package, which includes the proposed
chip merger of Hyundai Electronics Industries Co.
Ltd. and LG Semicon Co. Ltd.

Hyundai and LG have agreed that by Dec. 25, one
of the companies would take over control of the
new chip combine. The two companies have little
choice since independent U.S. consultant Arthur D.
Little Inc. will recommend on Dec. 22 whether
Hyundai or LG should run the merged chip
company.
The consultant firm is under contract
with the Korean government.

Today's industry agreement also confirmed that
Samsung Group will swap its fledging auto
manufacturing operation to Daewoo Group in
exchange for that firm's consumer electronics and
home appliance subsidiary.

The debt-to-equity swap approved by the
government was the latest wrinkle in the prolonged
struggle to get the chaebols' financial house in
order. No details were available on the amount of
debt that could be converted to equity or timetable
for the transactions. The debt swap is contingent
upon the chaebols selling off or closing down other
money-losing operations and securing foreign
investments. The five top chaebols agreed to cut
their number of subsidiaries in half from 264 to 130
within a year.

Previously the government had said any
debt-for-equity swap would bar the domestic bank
creditors from assuming management control of the
corporations from the shares of stock they would
receive.

U.S. electronic competitors, including Micron
Technologies Inc., have said they would scrutinize
any debt-for-equity conversion closely to be sure
the Korean chip chaebols weren't being bailed out
from alleged reckless borrowing of the past. The
Semiconductor Industry Association has been
adamant that no IMF rescue funds to Korean
domestic banks should be used to bail out that
country's chip producers.

The chaebols today also agreed to reduce their
debt-to-equity ratios from levels exceeding
500-700% and 1,000% in the case of Anam
Semiconductor to no more than 200% by the end
of 1999. Earlier the chaebols had sought to relax
the 200% level, claiming they might be unable to
reach that threshold by the turn of the century.

The chaebols again pledged to eliminate all
cross-subsidies among their affiliate operations by
the March 2000. Critics said the chaebols propped
by losing units by diverting funds from profitable
ventures.