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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Yousef who wrote (43479)	12/15/1998 7:39:00 PM
From: Kevin K. Spurway	Read Replies (2) \| Respond to of 1572922

Re: "material characterization, process integration (for yield), and reliability testing will take close to two years to reach manufacturability." I'm no process expert, but I'm willing to wager good money that AMD will have copper, low-K, etc. on .18u from Dresden before two years are up (that's December of 2000, by the way). Use your head, Youseless! Kevin

To: Yousef who wrote (43479)	12/15/1998 8:11:00 PM
From: kash johal	Respond to of 1572922

Yousef, >Re: ?? Let me tell you a >process development "double secret"; the material characterization, >process >integration (for yield), and reliability testing will take close to >two years >to reach manufacturability. I hope that analysts ask AMD "tough >questions" >about this issue ... People on this thread should watch this very >closely. Hey yousef, thanks for your double secret response. So, is it your prediction that it will take about 2 years from now for them to master this process. PS: I presume with this fab30 churning out lots of youseless wafers next year that we are about to see the imminent demise of AMD and it's stock price. Regards, Kash

To: Yousef who wrote (43479)	12/15/1998 10:43:00 PM
From: Paul Engel	Read Replies (2) \| Respond to of 1572922

Yousef - Re: "AMD hasn't settled on the low-k material it will be use, but barium-strontium-titanate (BST) and paraline compounds are candidates." AMD is claiming to be less than 1 year from "mass production" and they haven't even settled in on their Low K material ?? " Excellent observation, Yousef ! By the way - AMD made such a hoopla about Copper being the saving grace for AMD's advanced 0.18 micron process, don't you find it just a little bit "amusing" that AMD now is going to add a low-k dielectric in ADDITION to the copper? Question for AMDroids - why wasn't the Copper enough? Answer - see Intel's IEDM paper. Paul