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To: orkrious who wrote (20473)	12/18/1998 11:40:00 AM
From: BillyG	Respond to of 25960

The Fab Line -- From the December 14, 1998 Issue of Electronic News By Jeff Dorsch The International 300mm Initiative (I300I), part of International Sematech, printed 0.18-micron contact holes using an FPA-3000EX3L deep-ultraviolet stepper from Canon. The machine is capable of handling 300-millimeter wafers. I300I used a resolution enhancement technique called "triple exposure" with 0.22-micron optical proximity correction (OPC) contact mask, standard DUV resist and bottom anti-reflective coating (ARC). "This is another milestone, after our successful demonstration in September of the capability to print 0.12-micron lines and 0.24-micron spaces," said Dan Enloe, director of patterning technology of I300I. An I300I team, using a Canon FPA-3000EXL stepper in place since 1997, has been working on the progression from existence proof to a robust process, while continuing to push the envelope down into the range for 0.13-micron development. "With new resists coming and process optimization, smaller contact holes down to 0.15-micron and below can be achieved," Enloe said. "The significance of these results is that I300I is now ready to provide patterned test wafer services in support of development for the 0.13-micron technology node." Since installing four of its EX3L machines for development work at Selete, I300I and two of their member companies, Canon has moved ahead to provide a complete set of second-generation 300mm tools. Its second-generation 300mm toolset includes the FPA-5000ES2 KrF scanner and the FPA-5000AS1 ArF scanner, just announced. Both the ES2 and the AS1 are built on the dual-era 5000 Scanning System Platform, which is 200mm/300mm capable. Canon is now shipping its FPA-5000ES2 production model to "leading semiconductor manufacturers worldwide." Also, it will be shipping its first FPA-5000AS1 to Selete, the Japanese 300mm consortium that has been closely working with International Sematech for the global 300mm wafer transition. Canon has also installed 300mm I-line steppers at Semiconductor 300 (SC300), a joint venture between Siemens and Motorola in Dresden, Germany. These Canon FPA-3000i5L I-line steppers provide full 300mm wafer mix-and-match capability with the FPA-3000EX3L. The 300mm I-line capability allows realistic product piloting on 300mm wafers, including non-critical lithography layers. sumnet.com