SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : Spectrum Signal Processing (SSPI) -- Ignore unavailable to you. Want to Upgrade?


To: dwight martin who wrote (2084)12/22/1998 7:49:00 AM
From: nord  Respond to of 4400
 
I am sorry I didn't gp back and read prior URLs. I don't know the answer to your specific question. I do know that TI and Spectrum have been working on pico stations for LAN and Lan to Wan wireless

Business Wire Release: New TI Chip Blitzes Internet at Speed of 1.6
Billion Instructions Per Second Fact Sheet: Texas Instruments TMS320C6201 Digital Signal Processor

Editorial Backgrounder: Powerful New Processor Eliminates Need for
Hardware Design

Editorial Backgrounder: TI's TMS320C6x DSP Family Enables Wireless
Pico-Stations

Editorial Backgrounder: Astonishingly Powerful Signal Processor Speeds
Transmission of Information Enables Faster Modems in a Smaller Footprint

Reader Inquiry:
1-800-477-8924, ext. 5300
Please refer to Profile #:
The Shrinking Wireless Telephone Base Station:

TI's TMS320C6x DSP Family Enables Wireless Pico-Stations

To most people, wireless telephones are the cellular or Personal
Communications System (PCS) instruments that they carry with them in the car, on the golf course, in the shopping mall, or wherever they go. But the phone handsets, though highly visible, are only half the story. The hidden half of the telephone is the base station, the system that relays calls from the handset to the telephone network and back. The phenomenal success of the wireless telephone industry continues to depend as much on effective base station design as it does on design of the handsets themselves.

Recognizing the importance of base stations, as well as other demanding wireless applications, Texas Instruments considered this piece of the
wireless infrastructure in the development of its new TMS320C6x Digital Signal Processor (DSP) family to address this important piece of the wireless infrastructure. This new family of DSP products is designed to bring the high performance, low cost per channel, and power efficiency required by emerging wireless base stations and other multichannel telecommunications applications.
The Evolution of Wireless Pico-Stations

Just as wireless handsets are continually shrinking, so are base
stations. In the past, base stations required a shed-sized building for a system that could transmit to and receive from handsets in an area -- a cell -- several kilometers in diameter. Today, crate-sized base stations are appearing that can augment the existing wireless network with smaller cells. Both the original "macro" stations and the new "micro" stations offer wide-area coverage; but the micro stations add the possibility of local-area coverage for PCS and cordless instruments in large plants, corporate offices and pedestrian malls, as well as support for local-area instruments that can transfer or hand off calls to wide-area PCS/cellular networks. Another issue is the real estate required for base station placement. It is much easier to find locations for micro-sized base stations.

The end of the decade will see the introduction of even smaller base
stations that support cells only a few hundred meters in diameter. These "pico" stations will continue the trend of bringing to office complexes and residential areas local-area wireless services that can be handed off to wide-area networks. An important technical advantage that small cells bring is a requirement for much lower transmission power in both base stations and handsets. At the same time, pico stations will have to hand off calls from station to station very quickly, especially calls from users in vehicles. These handoffs will demand much greater processing speed within the base station systems.
Pico-Station Requirements

In order to reduce the size of base stations while increasing the number of channels handled and services offered, original equipment
manufacturers (OEMs) face exacting design requirements. As the world's
leading supplier of DSPs and DSP Solutions, TI a key provider of the
technology that helps OEMs meet these requirements. An overriding OEM
concern, of course, is keeping system costs low, since the highly
competitive wireless market requires continual reduction in per-channel costs. TI's IC design and manufacturing is the key to rapid cost reduction, along with high performance, low power consumption, and the integration of key functions that simplify system design and help OEMs get their products to market faster.

Equivalent in importance to cost is high system performance, which helps
OEMs add more channels to their systems with fewer chips. Higher
performance also helps OEMs comply with digital standards, opening
bandwidth for more voice channels; or it may be used to increase voice
quality through improved voice coding schemes, echo cancellation and
other advanced functions. Signal encryption, which ensures greater
privacy for users and greater billing security for service providers,
also demands high system performance. TI DSPs are optimized to provide
the performance required for specific applications such as base
stations. In addition, TI product roadmaps assure OEMs that the IC
products they are using will continue to increase in performance, so
that future system generations can continue to evolve.

Another base station OEM requirement that TI must meet is the on-chip
integration of large amounts of memory. Base stations require
substantial blocks of RAM for handling rapid changes of data as callers
enter and depart cell areas. Other requirements include low IC power
consumption to reduce the need for space and fans for cooling the system
and to minimize the need for backup power. OEMs also need ICs with the
right set of peripherals, such as multiple serial ports, to help
designers implement multiple receive channels per DSP. Support for
multiple DSPs in the same system allows the processors to share memory,
buses and peripherals, minimizing board space and cost. On-chip
multiprocessing support appears in the form of host port interfaces that
allow the DSPs to communicate with each other.

TI has directed its hardware development efforts at providing solutions that address these and similar requirements. In addition, TI's strong software support helps an OEM achieve fast time to market with a new product, as well as ease of update for existing products in order to change or add standards. With good software support, OEMs find it easier to modify existing designs in order to enter new markets. TMS320C6x DSPs Meet Multichannel Application Needs

TI's highly successful TMS320C54x DSPs and DSP cores have been designed into handsets by a number of digital wireless OEMs. Now TI has launched its new TMS320C6x DSP family, which is designed to satisfy the needs of multichannel communication applications such as wireless base stations, multichannel modems, telephone switches and remote access servers. The new 'C6x DSPs are optimized for outstanding performance at a low cost per channel to enable pico stations and other innovative communication products of the future.

At the heart of the 'C6x design is an advanced Very Long Instruction
Word (VLIW) architecture, which increases the parallel execution of
instructions by packing up to eight 32-bit instructions into a single
cycle. An advanced C compiler generates code that operates at 3x
improvement in compiler efficiency over existing compilers. In addition to dramatically improving performance, the advanced VLIW architecture and compiler help reduce code development time for OEMs.

The first 'C6x products appearing are designed using 0.25-um CMOS
technology, with a roadmap to 0.18-um CMOS based on TI's
125-million-transistor TImeline technology. Because these processes are very thrifty in power consumption, 'C6x-based systems will run cool and be less expensive to operate.

TI's initial offering in the 'C6x family is its TMS320C6201, a
fixed-point device operating at 200 MHz. With its 5 nanosecond cycle
time and eight parallel execution units, the 'C6201 can process up to
1600 MIPS -- more than ten times the performance of previous DSPs. Among the operations used heavily in communications, multiply-accumulate operations (MACs) can be accomplished 400 million times per second, and a 1024-point complex Fast-Fourier Transform (FFT) requires only 70 microseconds. On-chip peripherals such as 1Mbit RAM, two timers and dual enhanced buffered serial ports further tailor the 'C6201 for base station systems. The dual enhanced buffered serial ports on the 'C6201 offer a glueless interface to T1/E1 telecommunications trunks. The 'C601 is the first DSP to offer enhanced buffered serial ports.

This 'C6x-based digital radio suite is optimized for commercial and
military signals intelligence (or surveillance) applications with
demanding down conversion and signal processing requirements. Other
market segments such as spectrum monitoring, cellular site testing,
cellular fraud detection, software radio communications, and wireless
base stations will also benefit from Spectrum's 'C6x digital radio
technology.

With the advent of the soft radio architectures, the need to make costly changes to system hardware infrastructure is eliminated. Spectrum's digital radio systems are inherently re-programmable and
re-configurable. Any functional unit can be changed via software without any manual intervention for a multitude of functions; for example, spectrum analysis and frequency demodulation. "Spectrum is the first company to completely integrate the very high processing power of the 'C6x chip with Harris' HSP50214 chip, giving designers fast time-to-market advantages, together with the ability to design flexible radio receivers where radio functions are definable through software programming," said Mike Radhanauth, Manager, Product Marketing at Spectrum.
Norden



To: dwight martin who wrote (2084)12/26/1998 8:41:00 AM
From: nord  Read Replies (1) | Respond to of 4400
 
Dwight

pulse position modulation
and ulta-wideband radio
Time Domain has an entirely different radio technology
here are a couple URL's for you. I tried to find something more about the technology and other than using pulse and lower power I was unable to find what distinguishes this from other radio comm. over s/w radio.The pdf files you offered suggest that this technology has been around for some time and is in use for some limited applications where it will not interefere with other signals using same frequencies in a larger transmission area. Let me know what you come up with. The first Urls has a search feature Happy hunting

comsoc.org
comsoc.org
Regards
Norden



To: dwight martin who wrote (2084)12/27/1998 8:41:00 PM
From: nord  Read Replies (1) | Respond to of 4400
 
More on the future of 3G Basestations Norden------------------------------------------------------------------------
Technologists define future cellular components
Stephan Ohr

San Diego - Technologists from the Nokia Research Center, Lucent Technologies' Bell Laboratories and the Virginia Polytechnic Institute took a stab at defining the component requirements for new-generation cellular systems at a wireless communications show here last week. Software radios and third-generation, or "3G," cell phones will be among the 21st-century services to depend on new wireless components and packaging techniques, the experts said.

Such services would benefit from smart antennas and advanced component technologies. But improving the bandwidth of A/D converters, increasing the DSP Mips rate and reducing the passive-component count on the cellular handset's RF front end will be the toughest job, the experts agreed.

Their remarks were delivered during the Sunday plenary session at the third annual Wireless Communications Conference, part of the International Microelectronics and Packaging Society (iMAPS) conference and exhibition here.

James Drehle of Hewlett-Packard Co. (Colorado Springs, Colo.), speaking as past president of iMAPS, said the semiconductor technologist needs to know more about the requirements of the wireless-system designer, and "the designer requires more knowledge about processes." Wireless technology-especially cellular telephony-will be a driver for IC component and packaging development, he said.

Shipments of cell phones surpassed PC shipments in 1996, confirmed Kari-Pekka Estola, vice president of Nokia and director of its electronics laboratory (Helsinki, Finland). More than 100 million cellular handsets will ship in 1998, he said, rising to 140 million in 1999.

Cell-phone usage is highest in Europe; as of March, penetration in the United States was only 21 percent, according to statistics from the World Bank. Thus, while the Asia-Pacific region-especially China-represents the largest growth opportunity, North America will account for some of next year's growth. Estola predicted there will be 2.6 billion cell-phone users worldwide in the year 2015.

The projected 3G cellular services may be a driver for North American business, said Estola, though Europeans are increasingly using GSM for data transmission and Internet Protocol services. The 3G services will use higher data rates, he said: 64 to 144 kbits/second in rural outdoor areas, 384 kbits/s in the urban outdoors and up to 2 Mbits/s indoors over short distances. Those higher data rates will allow the integration of multimedia services with cellular voice transmission.

That prospect has companies dreaming up a slew of new services; for example, local maps and restaurant guides could be downloaded onto a cell phone screen. Such services would give rise to software packages for voice recognition and specialized Web browsers, among others. A 3G search engine might allow you to play a few musical notes on a keyboard and download a list of symphonies and songs that use that theme, Estola said.

Some of the support technologies for such futuristic scenarios are already moving into place. An MPEG-7 compression standard, which would allow multimedia browsing, for example, could be defined by 2000.

While an obvious attention-getter, 3G phones would not stand alone, Estola said. They would be part of a service package that would include packet networks and interconnectivity with other computerized appliances, such as faxes and printers.

If 3G phones are one preoccupation of the wireless world, the software radio is another. Design requirements for such an animal were sketched by Jeff Reed, an associate professor at Virginia Tech (Blacksburg, Va.).

In principle, the software radio makes it possible for RF modulation schemes, signal parameters and data protocols handled by the RF front end to be configured and adjusted on the fly. While the content of those cellular systems would be dependent on DSP, Reed said, the reprogrammability applies to the RF front end, not just the baseband portions. He cited work done by Harris Semiconductor (Melbourne, Fla.) in software but suggested that the actual arrival of software radios will lag 3G phones by several years.

The software radio includes four major blocks: narrowband A/Ds and D/As, for voice conversion; microcontrollers and DSPs, for compression and modulation; wideband A/Ds and D/As, for driving RF components; and RF converters and antenna drivers. Thus, the enabling technologies would include faster data converters, more powerful processors, Java and other forms of downloadable software, said Reed.

The biggest "system engineering" issue, he said, lies in the RF front end-the transmitter/receiver section. The antenna, for example, is less than 10 percent of the wavelength of the carrier frequency. Because of its limited size, Reed said, the antenna can not easily support the multiple frequencies (900 MHz and 2 GHz) required for dual-mode phones. Obtaining full-duplex capability-the ability to send and receive from the same antenna at the same time-is something of a "black art," he said.

On the transmit side, phase noise of the local oscillator and transmitter power efficiency are major concerns. "The PA [power amplifier] seems to be the Achilles' heel of wireless," said Reed. With AMPS phones, he said, it absorbs 60 percent of the battery power; with digital IS-54, the percentage is more like 30 to 45 percent; and with FSM, it's 45 to 50 percent. Reed believes power efficiency is traded for low distortion and wide bandwidth: "A lot of power is wasted in the transmitter requirement."

For receivers, a strategic design decision is the placement of the wideband A/D converter in the RF signal-processing chain. The goal is to place it as far forward toward the antenna as possible, but that decision affects the cost, the component count and the requirements on the DSP.

The problem is that the A/D is a major power consumer, Reed said. The farther forward the A/D converter goes, the higher the sampling rate required; the higher the sampling rate, the greater the power consumption. The front end of a DECT phone, for example, consumes about 200 mW in use. Of that, some 40 mW are eaten by the receiver's low-noise amplifier; the RF mixer-oscillator consumes 50 mW. But the A/D converter uses 100 mW by itself.

The major advantage of pushing the A/D converter forward, though, is to save the power and component count absorbed by the RF tuning filters. The receive filter includes two elements: an initial bandpass filter and a second filter for spurious-image rejection. By putting the A/D converter at the head of the signal-processing chain, a variety of passive components and active tuning elements can be eliminated. And the DSP could do the majority of the work involved in extracting a clean signal.

The DSP could help compensate for cheaper RF components, Reed suggested. Advanced signal-processing techniques-smart antennas, for example-provide interference rejection. Multipath mitigation could be controlled using channel-estimation techniques. Compression techniques provide both RF modulation and voice enhancement, such as speech recognition, echo cancellation and elimination of background noise.

Certainly, Reed sees voice-recognition capabilities integrated into the cell phone. "It's too difficult to get a full keyboard into your handset," he said.

Fortunately, processors cost 4 or 5 cents per Mips, and "cheap Mips" would be an asset for the software radio, said Reed. The 3G phones, for example, would require more than 3 billion operations/s. Data converters that cost $4,000 10 years ago can now be obtained as semiconductor devices for a couple of dollars, said Reed.

Indeed, the celebration of semiconductor technologies was a common theme at iMAPS. Robert Frye of Bell Laboratories (Murray Hill, N.J.) pointed out that the first mobile cellular equipment, rolled out in Chicago field trials in 1978, had 130 ICs and 300 discrete semiconductor components, and occupied more than 2,000 cubic inches. The Motorola MicroTAC cellular handset introduced in 1994 occupies about 14 cubic inches and has 20 ICs and about 45 discretes. A contemporary PCMCIA module, said Frye, includes 15 SMT-packaged ICs and about 30 discretes. It takes up about 2 cubic inches.

The so-called "soft radio," which Bell Labs believes will be out around 2002, will have two ICs and five discretes. Estola of Nokia remarked that 10,000 transistors these days cost about the same amount as a paper clip.

Estola said that today's 2G handsets use an 8- or 16-bit microcontroller running at 10 MHz, a 3- to 30-Mips DSP for speech coding, another 30 Mips for radio-channel encoding and about 4 Mbits of memory. The system draws power from a nickel-metal-hydride or lithium-ion battery.

The baseband elements use 3-V CMOS, said Estola, though the RF transmitter/receiver section uses a proliferation of discretes, passive components and ASICs. Half of the terminal's work is already performed in software, he noted.

In contrast, said Estola, the 3G terminal of the year 2002 will likely use a 16- or 32-bit processor running at 50 MHz. It will pack an Li-ion or lithium-polymer battery and will use 1-V CMOS. Memory requirements will be up to 64 Mbits. If the previous generation relied on SMT-packaged ICs, the next will use micro-ball-grid arrays and multichip modules.

But the most dramatic change will be in the DSP Mips requirement. By Estola's reckoning, 3G will take 200 Mips for radio-channel coding, 30 Mips for speech coding, 50 Mips for voice control (a limited form of speech recognition) and 100 Mips for video coding.

The cell-phone handset of the year 2000 is still likely to contain 100 or more passives-fully 95 percent of the total components, said Estola.