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To: Mark Mandel who wrote (20494)12/22/1998 1:41:00 PM
From: Im-patient  Respond to of 25960
 
There was a somewhat comprehensive exchange about a year ago on this subject... Sorry I can't link you to the specifics....

You could do a search, but I believe the concensus was that this was a very far off developmental foray, with little to no impact or even probability of final product.

Zeev did comment, so you might just look for Zeev's comments around 12-18 months back.

Good luck.



To: Mark Mandel who wrote (20494)12/22/1998 1:59:00 PM
From: Zeev Hed  Read Replies (2) | Respond to of 25960
 
TRI-GUY, IMHO, Ball semiconductors' management have only one thing going for them "They got balls". I believe that in time it will prove to be another Trilogy story, some $200 MM of OPM down the drain. I can already see a lattice of these balls getting into resonance vibrations like that famous bridge in the northwest and collapsing of its own weight. And that, my friend, is the first of the many technical problems they will have to face. Heat dissipation is another, air is a lousy thermal conductors and getting the heat out of a matrix of these balls ain't gonna be a child play. Unless they come up with some market segments that can use a very small number of discrete circuits like that, I think it is going nowhere.

Zeev