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To: Zeev Hed who wrote (20505)12/24/1998 9:25:00 AM
From: TechHunter  Respond to of 25960
 
Zeev, Robert BillyG et al... Could this be a reason for fab upgrade delays? What is your thought on this?

eetimes.com

DynaChip ships third-generation FPGA family

By Craig Matsumoto
EE Times
(12/23/98, 2:00 p.m. EDT)

SUNNYVALE, Calif. —
DynaChip Corp. has begun shipping its third generation of FPGAs targeting the high end of the market. The family arrives as DynaChip watches competitors such as Xilinx Inc. beginning to encroach on its high-speed niche.

As with DynaChip's earlier devices, the new DY6000 parts are
based on an “active-repeater” structure, which buffers signals at
each interconnect juncture to speed overall performance. This
architecture also makes delays deterministic — a signal's real
speed moving through the chip will match the performance
calculated on paper.

DynaChip builds its parts entirely for speed, targeting those
slices of the FPGA market that push performance, the company
said. Data communications and video processing top the list.

The DY6000 family adds to every logic block 32 bits of
synchronous, dual-clock, two-port RAM, usable as scratchpad
memory or, more notably, as FIFOs for rate matching. This
feature was added with data networking in mind, where FIFOs
often are needed for shuttling data between two buses of
differing speeds.

Other timing improvements come from programmable analog
phase-locked loops, designed by DynaChip and different from
those used in previous chips. They can be used to fine-tune clock
signals “to eke out the last bit of performance,” said Don
MacLennan, chief executive officer for the company, based here.
For example, the PLLs can be set to keep blocks running a few
nanoseconds ahead of the actual clock edges.

The DY6000 also can be reconfigured dynamically, changing
sections of the circuit while the chip continues to run, a feature
that's come in handy with at least one data-encryption scheme.
“There aren't many FPGAs out there where you can do that,”
MacLennan said. “This is the only one that's available to
customers.”

Fabless DynaChip uses Taiwan Semiconductor Manufacturing
Co. as its principal foundry and will have 0.25-micron parts
available from TSMC early next year, MacLennan said. That
pace keeps DynaChip one process generation behind competitors
such as Xilinx, but so far that's not been a handicap. “We seem
to get similar speeds on 0.35 [micron] as they do with 0.25
today,” MacLennan said.

For now, DynaChip chooses to shy away from the cutting-edge
processes such as pilot 0.18-micron technologies offered by
many foundries. That might change as the competition begins
encroaching on the high-speed market, but for now, the
company is content with finding “a low-risk way to get the most
advanced technology possible,” MacLennan said.

Already in production, the 55,000-gate DY6055 is the first of
four planned devices for the DY6000 family. The others, ranging
from 9,000 to 35,000 gates, are available in sample quantities.

Happy Holidays to all may 1999 be the year of the laser!

Craig



To: Zeev Hed who wrote (20505)12/24/1998 10:25:00 AM
From: BillyG  Respond to of 25960
 
12-25-98 Hyundai to control joint chip company; LG rejects decision, clouding the merger
koreaherald.co.kr

By Yoo Cheong-mo Staff reporter

Hyundai Electronics Industries Co. was named as winner of the drawn-out battle with LG
Semicon Co. to hold a controlling stake of their proposed joint semiconductor company by a
U.S. evaluating agency yesterday. LG Semicon, however, immediately refused to accept the
judgement, casting a dark cloud over their eventual consolidation into the world's
second-largest memory chip maker.

Announcing the results of its month-long evaluation of the two semiconductor makers, the
U.S. consultant, Arthur D. Little, said that Hyundai earned better grades than LG in almost all
of the 15 criteria, including technology, production, marketing and finances. "It has been
concluded that Hyundai is better qualified to take the controlling 70-percent stake in the
merged concern with LG," said Jung Taesoo, managing director of ADL Korea. Emphasizing
the need for a merger, Jung said, "Future technology investments will be extremely expensive,
leaving second-tier firms, like Hyundai and LG, vulnerable to downturns."

Hyundai welcomed the ADL assessment, while LG immediately declared an intent to disobey
the results, dimming the prospect for their union. "The ADL report lacked the necessary basic
factors for a fair evaluation," Koo Bon-joon, president of LG Semicon, said in a statement.
"There has been no agreement with LG on the evaluation factors and criteria. As the process
has been carried out in onesided manner, the report can not be considered a responsible
opinion," he said.

The Hyundai-LG merger, touted as the jewel of the government-initiated corporate
restructuring drive, or "big deal," is supposed to create the world's second-largest maker of
dynamic random access memory, or DRAM, chips with a global market share of 15.7
percent, after Samsung Electronics Co. But analysts forecast that LG, the nation's
fourth-largest conglomerate, would seek an independent survival for its semiconductor
operations. Actually, LG has expressed an adamant will to stick to the chip business, insisting
that semiconductors are indispensable to its long-term strategy to specialize in electronics.

Meanwhile, LG Semicon's decision to reject the merger deal and go it alone will push the
drawn-out semiconductor big deal into a wholly new phase, as the government reiterated its
willingness to take harsh financial sanctions against the firm. "Suspension of new credit and
withdrawal of existing loans will be among the punitive measures," said a spokesman at the
Financial Supervisory Commission. Despite the hardline stance, however, many industry
analysts are skeptical that regulators will actually carry out their avowed sanctions to the
extent of liquidating the giant chip maker.

"The government is sure to feel heavy burdens in dealing a fatal blow to LG Semicon, which
employs about 10,000 employees and has an estimated 6 trillion won ($5 billion) in bank
loans," an official at the Federation of Korean Industries. "Moreover, the latest recovery in
global chip prices will largely restrict the government's attempt at punishment." At the same
time, however, the analysts do not rule out the possibility of the government resorting to an
unexpectedly tough steps.

"As seen in the recent dismissal of the information-communication minister, President Kim and
his aides have signaled a strong intent to push through the big deals," a watcher said. Lately,
some economists at even state-run think tanks raised negative views over the proposed
semiconductor merger, but were immediately hushed by the hardline reformers. Regardless of
the contents of the financial sanctions, the looming confrontations between the government
and LG will have enormous impact on the second round of big deals expected to take place
next year, the analysts said.



To: Zeev Hed who wrote (20505)12/24/1998 4:39:00 PM
From: TideGlider  Read Replies (1) | Respond to of 25960
 
Best Wishes and Happy Holidays to All! May you be healthy and happy!

TG

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