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Technology Stocks : ADFLEX SOLUTIONS ( AFLX ) -- Ignore unavailable to you. Want to Upgrade?


To: Kent Sarikaya who wrote (486)1/8/1999 5:24:00 PM
From: Douglas V. Fant  Respond to of 718
 
Kent, My guess is that AFLX has at least a decent ongoing flip chip business judging from the amount of contacts between FCT Inc in the Phoenix area which makes components for flip chips (ball grid arrays).

FCT and AFLX are working together on the next generation BGA's....Seea attached May Press Release...This announcement blew right by the financial commnity- noone noticed it...

Sincerely,

Doug F.

FOR IMMEDIATE RELEASE

ADFLEX SOLUTIONS TO TEAM WITH FLIP CHIP TECHNOLOGIES TO ADVANCE
FLEX DESIGN AND ASSEMBLY CAPABILITIES

CHANDLER, Arizona (May 12, 1998) - ADFlex Solutions, Inc. (Nasdaq NM: AFLX) today announced that it has teamed with Flip Chip Technologies, L.L.C. (FCT) to develop fine pitch solutions to address evolving technical needs in the computer, communications, and consumer electronics industries.

According to the companies, the joint program is expected to demonstrate a 25% reduction in current bump pitch to allow significant cost reductions in future silicon and flex circuit products. The companies also anticipate that the use of flip chip will promote gains in electrical performance, profile-size reductions, and decreased manufacturing and product costs. The effort will focus on advancing flexible circuit substrate and assembly technology employing the combined synergies of ADFlex's one-stop shop capabilities, and FCT's proprietary flip-chip bumping and wafer processing services.

Said Rolando C. Esteverena, ADFlex President and Chief Executive Officer, "This alliance we believe is very positive for ADFlex, FCT and our customers. This is a relationship that enhances our one-stop-shop capability. We already offer OEMs significant advantages of a single-source service for design, development and volume manufacturing of both flexible circuits and component assembly technologies. The ability to extend this service to include device bumping in conjunction with FCT will bring further efficiencies in product development cycles, technical capabilities and production costs."ADFlex believes the effort will ultimately bolster its position as a leading single-source worldwide supplier service in flex circuitry design, production and assembly.

Said Harry Hollack, FCT President and CEO, "We are very excited about this collaborative effort to address the evolving needs of our customers by taking advantage of the respective capabilities of our two organizations."

"The approach we are taking in this effort is consistent with our mission statement to be the world's premier wafer bumping resource through customer satisfaction and leading edge technology. Our partnering with ADFlex is an example of our commitment to be at the leading edge of technologies through establishing relationships to better service the needs of our customers."

ADFlex has developed fine pitch flexible circuit technology specifically to support flip chip. The company plans to further enhance fine pitch in single and double sided flex circuit processes and flip chip assembly technologies with the aid of advanced bump technology provided by FCT to produce highly cost effective and reliable products.

In the joint effort, FCT will provide solder bumping for a variety of fine pitch peripheral and array footprints which specifically address next generation Flip Chip-On-Flex (FCOF) requirements. The program will focus on defining qualifying factors that enable high yield assembly. This system level approach will determine the most effective devices and substrate layouts with respect to solder bump sizes, I/O placements and assembly processes. The program is expected to provide an extremely rugged and reliable assembly.

ADFlex Solutions, Inc. is a leading supplier of flexible circuit-based interconnect solutions to the computer, computer peripheral, communication and other industries. Applications for flex-based interconnects include cellular telephones, hard disk drives and other storage systems, high-end consumer products, notebook computers, pagers and personal communications systems.

FCT is an innovative, high-volume wafer bumping resource providing services and expertise to the semiconductor industry based on proven technology. A joint venture of Delco Electronics and Kulicke & Soffa Industries, FCT is an ISO 9002 and QS 9000 certified company formed in 1996 to offer merchant bumping services used in applications requiring higher performance, reduced form factor and lower costs than available through traditional surface mount technologies.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995:The statements contained in this release which are not historical facts may contain forward-looking statement that involve risks and uncertainties, including, but not limitedto, the success of ADFlex's collaborative efforts with FCT, and whether such efforts willbolster the Company's position as a leading flex supplier, and other risks detailed inthe Company's annual report on Form 10-K for the year ended December 31, 1997.

Flip Chip Technologies - 3701 E. University Drive - Phoenix, AZ 85034 tel: 602-431-6020 - fax: 602-431-6021 - web: www.flipchip.com



To: Kent Sarikaya who wrote (486)1/8/1999 5:35:00 PM
From: Douglas V. Fant  Read Replies (1) | Respond to of 718
 
Kent, Now do you want to know why I got back heavily into AFLX at this time? Of course it backed and filled from a technical perspective, but also this announcement that Flip Chip Technologies Inc posted at their website:

FLIP CHIP TECHNOLOGIES INTRODUCES NEW AROUND-THE-CLOCK
MANUFACTURING SCHEDULE

PHOENIX, ARIZONA (January 7, 1999) - Flip Chip Technologies (FCT), L.L.C. announced today it has introduced seven day, around-the-clock fab operations. The new schedule is comprised of four shifts on a compressed work week with each shift working 12 hours on their assigned days. The move to this manufacturing schedule, from a two-shift, five-day structure, will allow FCT to further improve its turnaround times for customers, better utilize production equipment and increase employee satisfaction.

"The new schedule enables us to support increasing bumping service demand from our customers. This change also helps us accommodate our customer's critical production schedules by providing quicker turnaround times with the same world-class quality of service," said John Herman, Vice President of Operations for FCT.

According to Harry Hollack, President and CEO of FCT, "We continue to work hard to achieve the goals we have set for 1999. As our customer base and volumes grow, the additional manufacturing capacity achieved by working through the weekend will expedite our progress. Last quarter we exceeded our revenue expectations, almost doubled our volume, and maintained very high yields."

"This move further demonstrates FCT's commitment to be the world's premier interconnect and wafer processing service. We are taking the initiative to meet our customer's current needs while looking ahead to address their future requirements," added Hollack.

FCT is an innovative, high-volume wafer bumping resource providing IC packaging services and expertise to the semiconductor industry. A joint venture of Delphi Delco Electronics Systems and Kulicke & Soffa Industries, FCT is an ISO 9002 and QS 9000 certified company formed in 1996. FCT offers proven merchant bumping services used in applications requiring higher performance, reduced form factor and lower costs than those obtainable through traditional surface mount technologies. FCT's newest product, the Ultra CSPTM, is a revolutionary wafer-level chip size package and the mostcost-effective CSP in the market today.

Flip Chip Technologies - 3701 E. University Drive - Phoenix, AZ 85034 tel: 602-431-6020 - fax: 602-431-6021 - web: www.flipchip.com

AFLX and FCT are both Phoenix-based. Since AFLX and FCT cooperate in flip chip research, then it's a good bet that AFLX buys its BGA's for the flip chips from FCT. And here FCT says customer demand is increasing. This is just a clue, but I think a good clue that flip chip demand is growing, and it's growing specifically for AFLX. We'll find out in about ten days when AFLX release sits earnings report