LSI Logic Supplies Siemens With System-on-a-Chip
ASICs for Their EWSD Switches
Siemens Chose a System-on-a-Chip Approach and Reduced System Configuration Space by 4X
and Development Time by 25%
BRACKNELL, England, Jan. 18 /PRNewswire/ -- LSI Logic Corporation, (NYSE: LSI - news) The System On A Chip
Company®, today announced that it is supplying three high-performance system-on-a-chip ASICs for Siemens' EWSD
(Digital Electronic Switching System/Elektronisches Waehlsystem) Power Node switch, the world's leading narrowband
switching product.
The three ASICs, which are integrated in the message buffer unit of the EWSD, are true system-on-a-chip designs as they
integrate a processor core, application-specific IP and memory elements on a single chip, and together, they define the function
of the system. These ASICs are responsible for routing the messages, handling the protocols and doing maintenance, and they
serve as the interface between the coordination processor and the switching network.
Siemens made a strategic decision to move away from standard components and adopt a system-on-a-chip approach to
enable them to achieve maximum performance and scalability for their next generation system. With this innovative
implementation, they were able to reduce the system configuration space of the message buffer by a factor of four, increase the
system performance and offer a scalable system that gives the EWSD the headroom to handle the increasing switching
demands into the millennium. Siemens also dramatically cut the prototype testing time by using co-verification techniques.
To achieve the system performance, price and scalability requirements, three different ASICs were specified for three separate
boards, and each ASIC required an embedded microprocessor. Siemens selected LSI Logic's MiniRISC® CW4003 MIPS
CPU core and HDLC (High-Level Data Link Controller) protocol core from LSI Logic's CoreWare® library for these
designs.
''By applying system-on-a-chip technology to a multiprocessor switch design, we were able to achieve our targets of more
power for higher performance switching, innovative system design to enable new features like web access and, finally, bringing
to market a state-of-the-art product that redefines switching architecture's of the future,'' said Mr. Johann Haslinger, director
R&D, Siemens AG. ''For this kind of achievement, it is essential to work closely with your semiconductor supplier, and we
had outstanding support from LSI Logic throughout the entire design process.''
The message buffer's complex system configuration, which when fully configured will comprise up to 76 processors populating
15 boards and all connected by high-speed point-to-point serial links, required a robust design methodology to include
hardware and software co-verification, on-chip software debug and built-in-self-test that achieved 90% fault coverage. To
ensure the highest system reliability, the built-in-self-test feature also operates in the working system, enabling Siemens to
identify any problems and make repairs without interrupting the system.
Co-verification was an essential element in the success of the message buffer project and produced substantial time-to-market
advantages. LSI Logic provided the VHDL models of the processor and HDLC cores. The co-verification environment
comprised LSI Logic's MiniSIM® instruction set simulator, Synopsys' Eagle-I hardware/ software co-verification tool and
Synopsys' Cyclone® hardware simulator.
With this approach, software engineers were able to debug the target software on the virtual devices and see the interaction of
the three different ASICs. Once verified, a substantial part of the target software could be used for system verification and this
was completed in half the time compared to the previous generation design. Siemens was then able to bring up the hardware
and run the system integration tests which only took three months, half of the time it took for the previous design.
A key feature of LSI Logic's CW4003 CPU core is the ability to customize the cache and RAM sizes. This gave Siemens the
flexibility to tune the microprocessor subsystem for the application and optimize the design for price/performance.
''Fundamental to our success as The System on a Chip Company is our underlying ASIC technology and methodology which
are being selected by market leaders, like Siemens, to produce very complex, highly integrated solutions,'' said John Daane,
executive vice president of Communications, Computer, Storage Components and ASIC products. ''We are extremely
pleased to have been selected as the system supplier for the Siemens' message buffer designs. This is yet another example of
our strategy to serve trendsetting customers in selected markets, and it demonstrates how LSI Logic's core competencies are
being used to deliver true system-on-a-chip devices, with time-to-market, performance and price advantages.''
LSI Logic company background
LSI Logic Corporation, The System on a Chip Companya, is a leading supplier of custom high-performance semiconductors,
with operations world-wide. The company enables customers to build complete systems on a single chip with its CoreWare®
design programme, which increases performance, lowers system costs and accelerates time to market. LSI Logic develops
application-optimized products in co-operation with trend setting customers, and operates leading-edge manufacturing facilities
to produce submicron geometry chips. The company maintains a high level of quality as demonstrated by its ISO 900x
certifications. LSI Logic Corporation is headquartered at 1551 McCarthy Boulevard, Milpitas, California 95035,
lsilogic.com. |
