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To: Ian@SI who wrote (1926)1/16/1999 9:17:00 PM
From: Ian@SI  Read Replies (2) | Respond to of 2946
 
Interesting snippet from an SBN article...

The reason for the Tinsley acquisition becomes more clear.

...
Harriott welcomed the Sematech workshop vote for Scalpel and hoped the consortium would follow up by funding mask development for his system. Sematech all along has supported next-generation lithography by funding development of infrastructure technology. But the consortium hasn't supported any of the new exposure tools, leaving that to their corporate champions.

The competing EUV camp also is making good progress. Silicon Valley Group Inc. unveiled a timetable at the Sematech workshop that outpaces the SIA's Semiconductor Technology Roadmap for 0.07-micron feature size tools. SVG Lithography in Wilton, Conn., will have its EUV beta tool ready to turn out wafers with this feature size on production lines "well before the 2007 roadmap deadline," according to John Shamaly, vice president of marketing at parent SVG. He predicted the tool will be able to move down to 0.03-micron design rules.

Lenses and focusing optics for the commercial EUV tool are being developed by SVG's Tinsley division. The SVGL system will use TRW Inc.'s laser energy source and EUV masks being developed by the EUV LLC consortium in conjunction with the Department of Energy's Lawrence Livermore Laboratory and Sandia National Laboratory
...


Whole article at:

semibiznews.com