SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : Rambus (RMBS) - Eagle or Penguin -- Ignore unavailable to you. Want to Upgrade?


To: Alan Hume who wrote (13857)1/19/1999 7:41:00 AM
From: Red Scouser  Respond to of 93625
 
*** News ***
Winbond Electronics Wins U.S. Rambus DRAM Technology License

Taipei, Jan. 19 (Bloomberg) -- Winbond Electronics Corp., one of Taiwan's largest computer memory chipmakers, said it received a technology licensing agreement from the U.S.-based Rambus Inc. for the production of advanced chips.

Winbond will start test run production of the new 128- megabit to 144-megabit dynamic random access memory (DRAM) chips in the third quarter and mass produce them in the fourth quarter.

''Winbond and Rambus will become important partners,'' Rambus vice president Allen Roberts said, in a Winbond statement.

Taiwan's electronic companies often need to strike technology licensing agreements with overseas companies to elevate their production technology, due to insufficient research and development ability.

Winbond closed down NT$0.70 ($0.02) at NT$39.50 today.

05:45:02 01/19/1999



To: Alan Hume who wrote (13857)1/19/1999 7:43:00 AM
From: Red Scouser  Respond to of 93625
 
Winbond <2344.TW> in licence agreement with Rambus

TAIPEI, Jan 19 (Reuters) - Taiwan's Winbond Electronics Corp <2344.TW> said on Tuesday it obtained a licencing agreement with Rambus Inc <RMBS.O> of the United States to make high-bandwidth memory chips.

"Winbond has taken a licence for the Rambus TM high-bandwidth memory-interface technology," the company said in a joint statement with Rambus, the Mountain View, California-based company.

"Winbond will incorporate the interface into forthcoming 144M/128M and beyond dynamic random access memories, with initial devices expected to sample in the third quarter of 1999 and volume production planned for the fourth quarter 1999," it said.

04:39 01-19-99