To: Bernard Super who wrote (13909 ) 1/19/1999 7:22:00 PM From: unclewest Respond to of 93625
did this get posted? today's news. it just keeps getting better. biz.yahoo.com Tuesday January 19, 9:08 am Eastern Time Company Press Release Winbond to Provide 1.6GB/sec Rambus Memory Devices Leading Taiwan DRAM Company to Sample Initial Devices in Q3 1999 HSINCHU, Taiwan and MOUNTAIN VIEW, Calif.--(BUSINESS WIRE)-- Jan. 19, 1999--Winbond Electronics Corporation and Rambus Inc. (Nasdaq:RMBS - news), today announced that Winbond has taken a license for the Rambus® high-bandwidth memory-interface technology. Winbond will incorporate the interface into forthcoming 144M/128M and beyond dynamic random access memories (DRAMs), with initial devices expected to sample in the third quarter of 1999 and volume production planned for the fourth quarter, year 1999. ''Rambus DRAMs will be a strategic part of our product line,'' said Executive Vice-President Dr. Kuang-Yi Chiu, Winbond. ''Winbond is committed to meeting the PC industry's need for higher memory bandwidth, and we intend to be an important supplier to PC companies. ''Winbond will be a key Rambus partner as we continue to move toward volume production of the RDRAM®,'' said Allen Roberts, vice president and general manager of Rambus Inc.'s Memory Technology Division. ''Winbond will add production capacity in Taiwan which is important to support the worldwide volume ramp of RDRAMs.'' Rambus technology will enable the DRAM industry's highest level of performance to date -- 1.6 gigabytes per second of peak bandwidth from a single device -- and will span multiple generations of DRAM devices (through 1-gigabit densities). Rambus RIMM memory upgrade modules using RDRAMs use industry standard, DIMM-like form factor to fit within the motherboard space of today's memory systems. Planned applications for Rambus memory include computer system, multimedia and graphics, communications system, and consumer electronics. To date, more than 40 companies are developing Rambus logic chips; Intel Corp. [Nasdaq:INTC - news] has announced plans to enable Rambus technology for main memory in mainstream desktop performance PCs; and more than 50 companies representing the leaders in system-memory implementation products -- including memory modules, connectors, clock chips and test systems -- have announced their intention to support the technology. Winbond Electronics Corporation is the largest branded IC company in Taiwan. Winbond's product portfolio covers PC and peripheral-related ICs, consumer electronics ICs, multimedia ICs, SRAMs, non-volatile memory and DRAMs. Winbond has a leading position in Taiwan and East Asia in telephone dialers, PC I/O controllers, SRAMs, speech synthesizers and MPEG decoders. Winbond has three wafer fabs in operation, with current technologies ranging from 0.8um to 0.20um. Winbond also provides certain wafer capacity to serve foundry customers. Winbond is based in Hsinchu Science-Based Park, Taiwan, and has sales offices in Taipei, Hong Kong and San Jose, Calif. World Wide Web home page: winbond.com.tw .