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To: Alan Hume who wrote (14088)1/23/1999 2:01:00 AM
From: Don Green  Respond to of 93625
 
Chinese New Year...Tuesday, February 16, 1999 it will be the Year of the Rabbit.

regards
don



To: Alan Hume who wrote (14088)1/23/1999 8:56:00 AM
From: MileHigh  Read Replies (3) | Respond to of 93625
 
January 25, 1999, Issue: 1045
Section: Semiconductors
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IBM, Reliance lead march toward Direct Rambus alternative -- Two in U.S. back 133-MHz SDRAM . . .
Anthony Cataldo

Santa Clara, Calif. - Though Intel Corp. has turned thumbs down on adding hooks to its chip sets for SDRAMs running faster than PC/100, several chip makers don't see things the same way. A small chip-set company in the microprocessor giant's backyard, Reliance Computer Corp., and IBM Corp. across the continent believe there's plenty of life left in synchronous DRAMs. Carving a path that parallels Intel's straight road to Rambus, the companies foresee using PC133-standard 133-MHz SDRAMs first, and then double-data-rate (DDR) SDRAMs.

Advocates argue that the performance gain from 133-MHz SDRAMs is significant. Where Direct Rambus DRAMs are dogged by a supply shortage (see Jan. 18, page 1), the next generation of SDRAMs will be plentiful, as DRAM vendors will find it relatively easy to tweak their process to bump up the speeds. Certain modifications need to be made to the dual in-line memory module (DIMM). But they're fairly straightforward.

Moreover, compared with the Rambus architecture, scaling to gigabytes or more of main memory is simple. Also, error correction with SDRAMs is well understood.

SDRAM at "133 MHz is the natural next-generation memory," said David Pulling, executive vice president of marketing at Reliance Computer, here, a developer of chip sets used largely in the server industry. "At the same time it's very low latency. We can do reads to memory much faster than any other memory technology. And the momentum for 133 is tremendous right now."

IBM Microelectronics (East Fishkill, N.Y.) announced last week that it would use its chip-stacking technology offer up to 256 Mbytes on a PC133 module, technology that would bridge to "a non-disruptive transition to DDR."

The IBM approach increases the processor-to-memory bus from 100 to 133 MHz and synchronizes those flows to near-DDR rates. While servers are the initial target, IBM said the technology could span the range, including low-end personal computers. Indeed, a number of Taiwanese chip-set companies said they will exploit the 133-MHz SDRAM architecture to serve low-cost systems.

IBM expects volume production to start next quarter. The modules use the company's 0.25-micron, 64-Mbit, second-generation SDRAM component.

"Our memory customers have expressed a strong interest in PC133 as an evolutionary step between PC/100 and DDR. This step ensures continued performance improvements in our memory products," said Walter Lange, memory marketing manager at IBM Microelectronics.

Pulling at Reliance said that "today, less than two months from the specification definition, Reliance has IBM's 128-Mbyte PC133-compliant DIMMs successfully running in our lab."

Will the faster SDRAMs be able to compete with the more revolutionary Rambus DRAMs? To Intel, which last year mulled the idea of supporting 133-MHz SDRAMs, moving to the faster speed grade is more trouble than it's worth. Intel advocates using the device for graphics subsystems, but not main memory. It remains a staunch supporter of Direct Rambus technology, a protocol-based DRAM that can run up to 800 MHz. The company is expected to introduce its first Direct RDRAM-compatible chip set by the second quarter.

"Building a viable 133-MHz spec for system memory is tough," said Pete MacWilliams, an Intel Fellow who heads the Santa Clara company's Memory Enabling group. "Maintaining backward compatibility to PC/100 requires a 3-ns hold time. This makes it very difficult to tighten the access time. The result is that the system timings need to be improved. Assuming the three-quarter DIMM configuration is still the design point, we believe this will require buffers, probably on the motherboard and module. That adds cost and latency," MacWilliams said.

Pulling acknowledged it is more difficult to meet the hold time with faster parts, but said Reliance managed to avoid using buffers on the motherboard. The faster SDRAM spec will need them on the module, but Reliance said that using buffered registered DIMMs is already commonplace for high-end systems.

On the supply side, the 133-MHz SDRAM will be available from many leading vendors. Among those that have announced parts are Mitsubishi Electric, LG Semicon, Hitachi and Micron. Reliance said it has worked closely with many of them to publish a spec sheet for all the DRAM vendors; it is to be updated this week. Soon, the company will submit the spec to Jedec and expects the standards body to post it on its Web site .

To DRAM vendors undergoing process-technology shifts to 0.18 micron starting this year, providing 133-MHz SDRAMs is "too easy to do," said Jim Sogas, director of DRAM marketing at Hitachi Semiconductor America Inc.(Brisbane, Calif.), which announced its 133-MHz SDRAM last year. The "133 is going to slide right in the middle in low-end PC servers and high-end desktops," he said. "It's just a tweak of the clock. The move from 100 to 133 is a very safe move." An additional benefit is that the memory-controller chip can include hooks to both 133-MHz SDRAMs and double-data-rate SDRAMs, which are also coming into volume production this year, Sogas said.

As for performance, Pulling claims 133-MHz SDRAM will hold its own against Rambus. He said the most critical parameter is how fast the MPU can fetch memory for the initial DRAM access. Pulling said 133-MHz SDRAMs can do the job 50 percent faster than Direct Rambus parts, which have a faster peak bandwidth of 1.6 Gbytes/second but a longer initial latency.

"In the Intel architecture, the key is fetching the first data word," he said. "When the MPU fetches the memory execution units are dead, so you always want to keep the processor going. In this market it's a no-no to have idle time."

Lots of bandwidth

That's not to minimize the importance of bandwidth for high-end systems that will hold up to 4 Gbytes of memory and link to hundreds of disk drives. "Rule No. 1 is to have more bandwidth than the system needs. We can do that by a factor of two," Pulling said. He added that Reliance included advanced error-correction capabilities-"chip-kill ECC," which he defined as "the next level of ECC for 1999 and beyond."

Reliance isn't the only company planning chip sets to exploit 133-MHz SDRAMs. The list includes Acer Laboratories, OPTi, Silicon Integrated Systems, Standard Micro Systems and Via Technologies. Many will be aiming at low-cost systems that in some cases will use the extra bandwidth for Unified Memory Architecture schemes. Reliance will be one of the few to focus on high-end systems.

Copyright ® 1999 CMP Media Inc.





To: Alan Hume who wrote (14088)1/23/1999 9:05:00 AM
From: MileHigh  Read Replies (1) | Respond to of 93625
 
New comments -- could reach 100 million RDRAM units next year!

January 25, 1999, Issue: 1144
Section: News
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Intel funds Samsung's transition to Rambus
Mark Hachman and Andrew MacLellan

Silicon Valley- Determined to underwrite the memory-IC industry's transition to Direct Rambus DRAM, Intel Corp. last week made a $100 million investment in Korean chip maker Samsung Electronics Co. Ltd.

The deal-as well as the $500 million Intel invested last October in Micron Technology Inc.- was orchestrated to ensure an ample supply of the high-speed memory to support Intel's upcoming Pentium III processor, which is architecturally linked to Direct RDRAM.

The agreement confirms a February 1998 EBN report that executives from the two companies were gathering at Intel's Santa Clara, Calif., headquarters to discuss a possible cash infusion.

The Samsung investment, which requires approval from both companies' boards of directors, will guarantee that the necessary fabrication, assembly, and test infrastructure is in place to allow Samsung to meet industry demand, Samsung said in a statement.

"Samsung is committed to be the leader in development and production of Direct RDRAM technology to support the needs of Intel and OEM customers," said Y.W. Lee, Samsung's president and chief executive.

According to the terms of the agreement, Intel will acquire convertible bonds exchangeable for common stock representing approximately 1% of Samsung's outstanding common stock. The approval of the Korean government is also required before the deal can be finalized.

By subsidizing Samsung's production plans, Intel is injecting much-needed capital into one of its largest suppliers, and helping to cushion Samsung from a prolonged DRAM pricing slide and a downturn in the Korean economy.

"The investment ensures Samsung will expedite Direct Rambus into production," said Sherry Garber, an analyst with Semico Research Corp., Phoenix.

It also complements Intel's two-part "umbrella strategy," which aims to boost PC performance by re-engineering system components, and to make the necessary corporate investments to spur market growth, said Patrick Gelsinger, vice president and general manager of Intel's desktop-products group.

"For the past five quarters, [the DRAM industry has] gone through some tough times," Gelsinger said. "In talking with people, they've had to go back to their boards to justify [every Rambus capital investment]."

According to Garber, the Intel stake may serve as more than just a financial incentive for Samsung. Citing several DRAM manufacturers, she said there is a prevailing belief that once a production line has been committed to Direct RDRAM, it cannot be cost-effectively reconfigured to allow production of other types of DRAM. Committing to Direct RDRAM can therefore be a risky move, she explained. Samsung could not be reached for comment.

Samsung is known to be an aggressive, high-volume manufacturer. Last November, the company announced it would boost production of 64-Mbit DRAM by 40%; and in October, Samsung said it would double capacity at a new fab in Austin, Texas, to 21,000 8-in. wafer starts per month. Intel took a small equity stake in the Austin fab in 1997 in exchange for a guarantee of supply.

In addition to more solidly aligning Intel with Direct RDRAM supplies, the latest investment deal spells out Samsung's commitment to Rambus memory in black and white. In a separate statement, Samsung forecast run rates of 500,000 72- and 144-Mbit Direct RDRAM chips per month in the first half of 1999, ramping to 5 million chips per month as the market expands in the second half of the year.

And, according to Asian press reports, Hyundai Electronics Industries Co. Ltd. will spend about $170 million to upgrade Direct Rambus production to meet a goal of 4 million 72-Mbit and 1 million 144-Mbit chips per month in the second half of 1999.

Needless to say, the public airing of such production figures was music to the ears of Direct RDRAM architect Rambus Inc., Mountain View, Calif.

"This is an incredibly strong statement to your readers that companies are not only willing to put their money up, but are also willing to put their reputations on the line," said Subodh Toprani, vice president and general manager of Rambus' logic products division. "Between these two companies alone, we might see 100 million RDRAM units next year."


Copyright ® 1999 CMP Media Inc.





To: Alan Hume who wrote (14088)1/23/1999 9:15:00 AM
From: MileHigh  Read Replies (1) | Respond to of 93625
 

January 25, 1999, Issue: 1045
Section: Semiconductors
--------------------------------------------------------------------------------
. . . As Taiwan chip makers hedge bets
Mark Carroll

Taipei, Taiwan - At the same time that Taiwan's chip-set industry is jumping on the PC133 bandwagon, they are also trying to obtain the licenses needed from Intel Corp. to do chip sets that will support the P6 bus and the Rambus memory architecture.

But Taiwan's mainboard and personal-computer makers are cautious about how quickly Rambus can be adopted this year at least, so they are investing in the PC133 as a near-term solution. "For 1999, a 133-MHz SDRAM solution is better than RDRAM [Rambus DRAM]," said an engineer at one of Taiwan's largest companies. "RDRAM has testing problems as well as undercapacity for the server market. The RIMM [Rambus In-line Memory Module] needs a redesign of the module-testing process. Also, with two or three slots, Rambus can only reach 256 Mbytes or 384 Mbytes of memory capacity. The server market is moving toward a 1-Gbyte main-memory capacity, which is a big challenge for a Rambus solution."

Royalty maneuver

Partly in order to save on royalty costs, the Taiwanese are quietly readying a PC133 SDRAM alternative. At least two Taiwanese core-logic vendors are working with SDRAM makers to offer such PC133 chip sets in the coming months. "In February, we will begin sampling a PC133 core-logic product," said a spokesman at one Taiwanese core-logic vendor. "It will be Pentium III-compatible and will have AGP 4X support."

The Taiwanese are not alone in their efforts to offer a non-Rambus solution. "Mitsubishi and Fujitsu are already sampling PC133 SDRAM," said the mainboard engineer, claiming that "along with the Taiwanese core-logic vendors, Intel will also offer PC133 core logic." An Intel spokesman declined to comment.

Acer Laboratories Inc. recently signed a Rambus license for a P6-based Rambus chip set due out late this year. A spokesperson said Acer has yet to sign the more fundamental Intel P6 bus license. Taiwan's two other major core-logic vendors said that they are first licensing the P6 bus before they attack the Rambus issue.

Via Technologies Inc. has already secured an Intel P6 bus license. "We now have licensed the P6 bus and are currently looking into licensing with Rambus," said a spokesman for Via. "Both Intel and Rambus' road maps, though, don't see RDRAM being available for PCs until late in the second quarter of this year."

Silicon Integrated Solutions (SIS) is nearing completion of both deals. "We are close to having a P6 bus license with Intel," said Shing Wang of SIS.

"There is no problem technically for us doing a Rambus solution. We are looking for when the market will support it."

Taiwan is less than excited about Rambus, given licensing fees and other issues. "Currently, there is a premium in testing Rambus vs. SDRAM," said Wang. "Also, RDRAM has about a 10 percent larger die size than traditional DRAM."

An analyst for the Taiwan branch of a major U.S. securities company said that the cost of testing RDRAM is coming down. "Recently, I attended a seminar put on by Rambus and Tessera here," said the analyst. "Tessera is one of the manufacturers of RDRAM test equipment. They presented data at the conference that showed that RDRAM testing costs are about 1.5 cents per I/O and will eventually go down to 1 cent per I/O. That's competitive with the testing costs of traditional DRAM."

Rambus is certainly pushing its technology here. "Rambus/Tessera are busy trying to get Taiwan manufacturers to license their technologies," said the securities analyst. "They are generally trying to create the necessary infrastructure for a transition to RDRAM to succeed."

The Taiwanese concede that RDRAM will eventually become important. "Intel will help support the transition to RDRAM," said the motherboard engineer. "Intel has invested in Samsung, which gives them leverage in having Samsung to produce RDRAM in quantity. Rambus is also verifying the RIMM module makers, which will help us in obtaining workable modules."

Copyright ® 1999 CMP Media Inc.