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Technology Stocks : Rambus (RMBS) - Eagle or Penguin -- Ignore unavailable to you. Want to Upgrade?

To: MileHigh who wrote (14135)	1/25/1999 8:45:00 AM
From: MileHigh	Read Replies (1) \| Respond to of 93625

Monday January 25, 6:01 am Eastern Time Company Press Release TSMC Announces Support for High-Bandwidth Rambus Memory in Its 0.25-um Process Technology Silicon-Verified RAC Accelerates Design Cycle SAN JOSE, Calif.--(BUSINESS WIRE)--Jan. 25, 1999--Taiwan Semiconductor Manufacturing Co. (TSMC)(NYSE:TSM - news) today announced an agreement to port the Rambus® ASIC Cell (RAC) to its 0.25-um logic process. The RAC offers superior performance and a high-bandwidth standard interface for high-volume, low-cost memory controllers to the Rambus 800MHz memory. End product applications include main memory chip sets, graphics controllers, multimedia controllers, peripheral controllers and network switch controllers. ''Rambus memory technology is becoming a valued element in high-performance systems,'' said Magnus Ryde, president, TSMC, USA. ''As a result of this agreement, TSMC's customers will be able to smoothly integrate Rambus interface technology into their designs.'' TSMC and Rambus plan to port the RAC to the TSMC 0.25-um logic process by April this year for silicon verification and characterization. Rambus will supply their common customers with RAC megacell for incorporation into customer product designs for manufacture at TSMC. Rambus Memory The RAC offers unprecedented performance -- 1.6 Gbytes/sec -- even from a single RDRAM® device. With its 800 Mbits per pin interface, the RAC is the highest bandwidth industry standard interface available. A 64 MB Rambus RIMM(TM) module is three times the performance of today's highest performing PC100 SDRAM DIMM module. ''By teaming up with TSMC, we are able to broaden the market for RDRAMs,'' said David Mooring, vice president and general manager for Rambus's PC division. ''Rambus' high-bandwidth memory interface, combined with TSMC's high-quality volume production capabilities, will facilitate wide-spread adoption and allow a variety of applications to perform at higher speeds.'' Over 50 companies support Rambus system components, including RDRAMs, modules, connectors, clock chips and production test systems. Rambus memory is expected to become the industry standard by the end of 1999. About Rambus Rambus Inc. develops high-speed interface technology that allows DRAMs and controllers or processors to transfer data at 800MHz over a two-byte wide channel supporting up to 1.6 gigabytes per second throughput. Rambus DRAMs are designed for low-cost, high volume manufacturing and use standard CMOS processing, plastic packages and conventional printed circuit board technology. Rambus is headquartered at 2465 Latham St., Mountain View, Calif., 94040; phone: 650/944-8000; fax: 650/944-8080; e-mail: info@rambus.com. More information can be found at rambus.com. About TSMC TSMC (ADS traded NYSE:TSM, also traded on TSE) is the world's largest dedicated integrated circuit (IC) foundry and offers a comprehensive set of IC fabrication processes, including processes to manufacture CMOS logic, mixed-mode, volatile and non-volatile memory and BiCMOS chips. Currently, TSMC operates two six-inch wafer fabs (Fab 1 and 2) and three eight-inch wafer fabs (Fab 3, 4 and 5), all located in Hsin-Chu, Taiwan. In mid-1998, TSMC announced that production wafers were being delivered from its first U.S. foundry, WaferTech, a joint venture with Altera, Analog Devices and Integrated Silicon Solutions Inc. The company has broken ground in the new Tainan Park, which will house Fabs 6 and 7 and recently announced its participation in a $1.2 billion joint venture fab with Philips Semiconductor which is scheduled to open in Singapore in 2000. TSMC's corporate headquarters are in Taiwan. More information about TSMC is available on the Web at www.tsmc.com. Note to the Editors: Rambus and RDRAM are registered trademarks of Rambus Inc. RIMM is a trademark of Rambus Inc. -------------------------------------------------------------------------------- Contact: TSMC, USA Chuck Byers, 408/451-2208 cbyers@tsmc.com or Rambus Inc. Julie Cates, 650/944-7725 cates@rambus.com or Pacifico, Inc. Mary Curtis, 408/293-8600 mcurtis@pacifico.com --------------------------------------------------------------------------------