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To: jmanvegas who wrote (14287)1/27/1999 3:31:00 PM
From: REH  Respond to of 93625
 
Show Match
Date: 01/27 15:08 EST

TOSHIBA CONTINUES STRING OF RAMBUS LEADERSHIP FIRSTS;

Toshiba Rev. B RDRAM Samples Enable Intel Testing of Fully Loaded
System

IRVINE, Calif., Jan. 27 /PRNewswire/ -- Toshiba America Electronic
Components, Inc. (TAEC) today announced another Rambus(R) technology
leadership achievement with the delivery of its 64 megabyte (MB) and
128MB Revision B Rambus RIMM(TM) memory module samples to Intel. This
makes Toshiba one of the first suppliers to submit samples that allow
Intel to test a fully loaded 800 megahertz (MHz) system with 32
RDRAM(R) devices.

"The process of going from the Direct RDRAM(TM) design to mass
production involves several steps. Toshiba's industry leading memory
device engineering and manufacturing capability, encapsulated in
Toshiba's Scalable by Design(TM) program, enabled us to hit every
milestone," said Stephen D. Marlow, vice president of business
development, Memory Business Unit at TAEC. "We intend to be the RDRAM
technology leader and this latest milestone is an indication that we
are well on our way."

"We are very pleased to see Toshiba deliver production samples of
Direct RDRAM," said Peter MacWilliams, Intel Fellow and director of
platform architecture for Intel architecture labs. "We believe Toshiba
will be a key vendor for the beginning phase of the Direct RDRAM ramp
in 1999."

Amplifying on his assertion, Marlow described the implementation of
Toshiba's Direct RDRAM program. In February 1998, he recalled, Rambus
completed the Direct RDRAM interface design and distributed it
simultaneously to all of the company's licensees. "In April, just two
months later, we were the first in the industry to achieve first
silicon. In June 1998 Rambus Inc. confirmed that Toshiba's 72 megabit
(Mb) Direct RDRAMs were the industry's first with confirmed 800MHz or
1.6 gigabytes per second functionality. That same month, we delivered
samples to Intel for evaluation," he said.

Toshiba RIMM modules were demonstrated in test boards running at 800MHz
at the Intel Developer's Forum and Rambus Developer's Forum, both in
September 1998. "We felt comfortably ahead of the industry as no other
manufacturer mounted a demonstration at these two key events," Marlow
explained. The next milestone was submitting RIMM module samples to
Rambus for PCB impedance verification and review of other key design
parameters in October 1998. "Again we were first," Marlow claimed, "and
Rambus devised new, improved testing methodologies while conducting
design verification of our modules." Toshiba, together with its
manufacturing partner, Kingston Technology Company, delivered Toshiba's
first RIMM modules to Dell Computer Corporation in mid-October.

At the end of October 1998 Toshiba submitted RIMM module samples to
Intel for validation testing in a system environment. "We were one of
the first manufacturers to provide RIMM module samples that booted in
systems running Windows(R) '98, and Windows NT," Marlow noted. Next
Toshiba RIMM modules powered Intel's RDRAM system demonstration at
Comdex in November 1998. "We're pleased we could help Intel beat their
aggressive target of having a working PC platform by the end of 1998,"
Marlow said.

In November Toshiba became the first supplier to provide OEMs with
Rambus-tested RIMM module samples.

PC platform technology continues to evolve to support more visual
applications and connectivity. Higher frequency processors and
enhanced graphics subsystems place higher bandwidth demands on the
memory subsystem. Rambus RIMM modules provide necessary headroom in
bandwidth with up to three times the effective performance of today's
PC 100 SDRAM DIMM modules. At the same time, Rambus RIMM modules use
DIMM-like standard industry assemblies and will fit within the
physical, power and thermal profiles of a similarly configured 100MHz
SDRAM memory system.

Toshiba was among the first semiconductor manufacturers to license
Rambus technology. TAEC demonstrated the industry's first RDRAM
working silicon in June 1992 and followed with the first Rambus-based
multimedia systems using Toshiba RDRAMs and ASICs in 1993.