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To: REH who wrote (14422)	1/28/1999 2:46:00 AM
From: Barry Grossman	Read Replies (1) \| Respond to of 93625

From the Intel thread: Message 7525691 To: Tenchusatsu (72332 ) From: Paul Engel Thursday, Jan 28 1999 2:14AM ET Reply # of 72334 Tenchusatsu & Intel Investors - Intel and RAMBUS are getting CLOSE ! Toshiba has just delivered a "B" version of Direct RDRAM RIMM Modules to Intel for full speed 800 MHz testing. Any bets as to what Intel will be doing with these ? Pentium III isn't due out for another month - on 440 BX chip sets - and Intel is way down the road on the Camino/820/Rambus/133 MHz/800 MHz upgrade. Who is the guy on the AMD thread who keeps complaining about Intel's aggressive technology introductions? Paul {=================================} semibiznews.com A service of Semiconductor Business News, CMP Media Inc. Story posted 7 p.m./4 p.m., PST, 1/27/99 Toshiba ships Rambus RIMMs to Intel for 800-MHz testing IRVINE, Calif. -- Toshiba America Electronic Components Inc. here today announced it has delivered samples of 64-megabyte and 128-Mbyte Rambus RIMM memory modules to Intel Corp. for testing in high-speed systems. The U.S. subsidiary of Japan's Toshiba Corp. claimed the company has become one of the first suppliers to provide samples of revision B Rambus modules that allows Intel to test fully loaded 800-MHz systems with 32 RDRAM devices, based on the memory architecture from Rambus Inc., Mountain View, Calif. "The process of going from the Direct RDRAM design to mass production involves several steps," said Stephen D. Marlow, vice president of business development in the Memory Business Unit of the Toshiba subsidiary. He credited Toshiba's Scalable by Design program as enabling the company to "to hit every milestone. Toshiba said its RIMM modules were demonstrated in test boards running at 800-MHz at the developer forums hosted by Intel and Rambus last September. -----------------------------

To: REH who wrote (14422)	1/28/1999 7:06:00 AM
From: REH	Read Replies (3) \| Respond to of 93625

Jan 27, 1999, (Comline via COMTEX) -- Samsung Electronics plans to launch mass production of Rambus DRAMs starting from the end of January, company sources said January 17. The company will produce 72-megabit and 144-megabit Rambus DRAMs, with initial monthly production projected at 500,000 chipseach. Monthly output of these two items will be raised to 5 million chips each during this year"s second half when the domestic market is fully formed. Demand for the items both at home and abroad is expected to grow rapidly as the items are being adopted as standard DRAMs for next generation computers by Intel, IBM, Dell and other major computer makers. The products from Samsung Electronics recently won the quality endorsement of Rambus, the US technical rights holder, the sources said. By putting wafers into production beginning late in January, Samsung plans to put the items on sale in the domestic market near the end of February. Samsung also plans to produce 288- megabit Rambus DRAMs toward the end of the year. The ratio of Rambus DRAMs in the domestic DRAM market will reach 30 percent this year, the sources predicted. reh