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Technology Stocks : Qualcomm Incorporated (QCOM) -- Ignore unavailable to you. Want to Upgrade?

To: Maurice Winn who wrote (22283)	2/1/1999 8:33:00 AM
From: 2brasil	Read Replies (1) \| Respond to of 152472

QUALCOMM Announces New CDMA RF Chip To Extend Performance of 3000-Generation Chipset Solution UD3000 Chip Offers Area Reduction and Power Savings SAN DIEGO, Feb. 1 /PRNewswire/ -- QUALCOMM Incorporated (Nasdaq: QCOM - news) today introduced its UD3000(TM) chip that will provide greater transmit functionality and enhanced performance of its 3000-generation chipset for an IS-95A or IS-95B Code Division Multiple Access (CDMA) compliant handset. Developed by QUALCOMM's ASIC Products, the UD3000 Intermediate Frequency-to- Radio Frequency (IF to RF) transmit (Tx) device performs all signal processing functions required between the QUALCOMM IFT3000(TM) baseband-to-IF processor and the power amplifier (PA). The UD3000 integrates single sideband upconversion from IF to RF, along with two cellular and two Personal Communications Service (PCS) driver amplifiers with the required output power to drive the PA. Consistent with QUALCOMM ASIC Product's progress in further integrating functions onto single chips, this new design architecture eliminates the need for a filter normally required between the upconverter and the driver amplifier, offering an overall savings to printed circuit board area and reduced handset cost. The UD3000 together with the IFT3000 comprise a baseband-to-RF chipset solution for the Tx path up to the PA. This new device is optimized for mobile handset transmit compatibility with the cellular and PCS frequency bands covering global CDMA markets. ''The development of the UD3000 chip is further evidence of our continuing support for manufacturers who require improvements in the operating efficiency and flexibility to support multiple frequency bands in their CDMA handsets,'' said Johan Lodenius, vice president of marketing for QUALCOMM's ASIC Products. ''Consumers will see the benefits of our 3000-generation chipset solution, including the UD3000 chip, when manufacturers using our solution begin shipping their smaller and more versatile handsets with significantly longer stand-by and talk times later this year.'' The UD3000 further complements QUALCOMM's 3000-generation CDMA chipsets for dual mode cellular (CDMA/AMPS), single-band PCS, or dual-band PCS (PCS CDMA/AMPS) handsets. QUALCOMM's industry-leading 3000-generation of CDMA chipsets for cellular and PCS applications includes: The MSM3000(TM) Mobile Station Modem (MSM(TM)) chipset and system software, the IFT3000 and IFR3000(TM) fully integrated IF chipset and the UD3000 chip. QUALCOMM's fifth-generation chip, the MSM3000, began production shipping in December 1998 on schedule. The low-power chipset and system software enable design of small form-factor handsets with very long stand-by times, support for data rates of up to 86.4 kbps and the delivery of hands-free operation and dialing. The IFT3000 and IFR3000 are the first chips to incorporate the complete IF functionality for a CDMA handset, from digital baseband converters to Automatic Gain Control (AGC), offering an area reduction of 45 percent over previous IF solutions and optimized power savings for extended standby-time and talk-time performance. Features of the UD3000 chip include: -- Driver amplifier gain control provided for improved Tx Dynamic Range and carrier-to-noise performance; -- Operating modes controlled by MSM3000 chip; -- Puncture mode for extended talk-time performance; and -- Power supply voltage range from 2.7 volts (V) to 3.3 V providing operating compatibility for handsets utilizing a single-cell Li-Ion battery design. The UD3000 chip is fabricated on an advanced BiCMOS process which enables both precision high-frequency analog circuits and low-power CMOS functions. The UD3000 chip will be provided in a 32-pin BCC++ plastic package. Sample shipping will begin in the second quarter of 1999. Production quantities are expected to be available in the third quarter of 1999. QUALCOMM ASIC Products Division is the leading developer and supplier of CDMA chipsets, hardware and software solutions and tools with more than 30 million MSM chips shipped worldwide. The ASIC Products Division supplies chipsets to the world's leading CDMA handset and infrastructure manufacturers including: ALPS ELECTRIC CO., LTD.; CASIO COMPUTER CO., LTD.; DENSO CORPORATION; FUJITSU LIMITED; Hitachi, Ltd.; LG Information and Communications, Ltd.; Samsung Electronics Ltd.; SANYO Electric Co., Ltd.; and TOSHIBA CORPORATION, among others. QUALCOMM Incorporated (Nasdaq: QCOM - news) is a leader in developing and delivering innovative digital wireless communications products and services based on the Company's CDMA digital technology. The Company's major business areas include CDMA phones; Application Specific Integrated Circuits (ASICs); wireless infrastructure; technology licensing; and satellite-based systems including OmniTRACS® and portions of the Globalstar(TM) system. QUALCOMM is headquartered in San Diego, Calif. QUALCOMM's fiscal 1998 revenues exceeded U.S. $3 billion. For more information, please visit the Company's web site at (http://www.qualcomm.com). Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including timely product development, the Company's ability to successfully manufacture significant quantities of CDMA or other equipment on a timely and profitable basis, and those related to performance guarantees, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 27, 1998, and most recent Form 10-Q. QUALCOMM and OmniTRACS are registered trademarks of QUALCOMM Incorporated. MSM, MSM3000, IFT3000, IFR3000 and UD3000 are trademarks of QUALCOMM Incorporated. Globalstar is a trademark of Loral QUALCOMM Satellite Services, Incorporated.