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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: Duker who wrote (27970)	2/2/1999 3:50:00 PM
From: Duker	Read Replies (1) \| Respond to of 70976

HHHHHUUUUUGGGGGEEEEE!!!!! Just to add color to my last post. I seldom get excited. I choose this moment to do so. --Duker

To: Duker who wrote (27970)	2/2/1999 4:48:00 PM
From: Proud_Infidel	Read Replies (1) \| Respond to of 70976

Giddyup!!!!!!!!!!!!!!!!!! Let the money machine begin to roll! Excellent!

To: Duker who wrote (27970)	2/2/1999 6:18:00 PM
From: Justa Werkenstiff	Read Replies (1) \| Respond to of 70976

Good news, but story must be verified before putting market orders to buy at open. Note article quotes unidentified "sources." INTC sources not quoted. Also, 300mm article seems to contradict this article from Oregonian published on January 26, 1999 which suggests that no new plants are scheduled for the forseeable future in Oregon: oregonlive.com

To: Duker who wrote (27970)	2/2/1999 7:20:00 PM
From: Suresh	Read Replies (1) \| Respond to of 70976

10-year, $10 billion program in the next-generation wafer size Let's see... $1 billion/year on an average... So, I guess it is not new money just the same pot that INTC uses every year. Should I be excited with this announcement ? -Suresh

To: Duker who wrote (27970)	2/2/1999 8:16:00 PM
From: Duker	Read Replies (2) \| Respond to of 70976

UPDATED 300mm Story ??? [Apparently someone wanted to edit the contents of the original message ... added "reportedly" and INTC comments ... sounds like the initial report jumped the gun a bit!] Intel reportedly moves ahead with 300-mm fab in Oregon By Jack Robertson SANTA CLARA, Calif. -- Intel Corp. here has decided to go ahead with its delayed 300-mm development fab in Hillsboro, Ore., and next month the company plans to announce a ten-year, $10 billion program to fund IC production on the larger wafer diameters, according to sources today. Intel's 300-mm development fab was put on hold last April after the company decided production tools were not ready in 1998. Intel then decided to revisit the decision at the end of 1998, and now it has apparently determined the time it right to restart the $1.5 billion pilot line project. A spokesman for Intel in Hillsboro said he was unaware of any decision to announce 300-mm plans but that the fab continues to be evaluated. "The facility is nearly completed, but the next phase remains in a state of 'suspended animation,'" he added. When the 300-mm development fab does begin its work, the facility will focus on 0.13-micron process technologies. Intel is expected to restart the Hillsboro fab project later this year and eventually expand the facility into its initial 300-mm production plant, according to the sources. Next month's announcement will cover a full-blown Intel plan to expand 300-mm production in multiple plants over the next decade. Intel's commitment to 300-mm is expected to help revive the chip industry's lagging interest in 300-mm wafers. Chip makers around the world have delayed 300-mm plans partly because of a lack of production-worthy tools, but mostly because of a severe glut of 200-mm fab capacity. To date, only Siemens AG and Motorola Inc.'s Semiconductor Products Sector have jointly set up a joint-venture 300-mm pilot line in Dresden, Germany. One major equipment firm, Applied Materials Inc., reportedly will reinstitute its own 300-mm program, based on a large order for equipment from Intel for the new Oregon fab. Along with the rest of industry, Applied froze its 300-mm program early last year when chip makers backed away from launching even pilot lines.