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To: Jerry Olson who wrote (23268)2/5/1999 8:34:00 AM
From: broken_cookie  Respond to of 50167
 
Hi Jerry,

Re: KLIC
Does K&S have a product that participates in the BGA (Ball Grid Array) packaging of semi's? There is substantial movement away from PQFP and TQFP fragile packages as less expensive printed circuit board techniques have been worked out for BGA's.

TIA

Rich