SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?


To: Proud_Infidel who wrote (28034)2/5/1999 1:08:00 AM
From: Jeffrey D  Read Replies (1) | Respond to of 70976
 
Brian:<<AMAT's Cu lineup to be ready by April:>>

Brian, Dr. Castellano of The Information Network confirms copper is gearing up later this year. He doesn't mention that AMAT will benefit from Cu. Perhaps he failed to notice that AMAT will have its copper products ready by April. Best regards, Jeff

<<

Copper Tools for IC Production to Reach $1 Billion Mark in 2000 According to the Information Network

--------------------------------------------------------------------------------

Story Filed: Thursday, February 04, 1999 07:15 PM EST

NEW TRIPOLI, PA (Feb. 4) BUSINESS WIRE -Feb. 4, 1999--The market for front-end equipment for copper processing of IC interconnects will triple to slightly more than $1 billion in 2000, according to the report 300mm/Copper/Low-K Convergence: Timing, Trends, Issues, Market Analysis, recently published by The Information Network, a New Tripoli, PA-based market research company.

"With 300mm on the back burner, our analysis shows that copper technology is the next market mover," notes Dr. Robert N. Castellano, President of The Information Network. "Most of the major semiconductor manufacturers have announced production plans for copper and with the exception of IBM and Motorola are all scheduled to begin production in mid-1999 to mid-2000 timeframe."

Most companies had planned to transition to copper at the 0.15 or 0.13 micron design. Because of IBM (NYSE:IBM) and Motorola (NYSE:MOT), that transition was pushed up to 0.18 micron, primarily for fear that the demand for high-speed ASIC requirements will push ASIC suppliers to foundries that could offer the technology.

Copper capabilities offers companies an opportunity to gain a technological edge with its products. While it is now and in the near future will be a niche market, it will become mainstream within five years, moving into high gear with 0.15- and 0.13-micron manufacturing.

The reports analyzes the market for all copper front-end tools, including Electroplating, Barrier/Seed, Dielectric Etch, CMP, Dielectric Deposition, Metrology, RTP, and Metal Etch.

Companies poised to take advantage of the opportunities in the nascent copper market include Novellus (NASDAQ:NVLS), Semitool (NASDAQ:SMTL), Lam Research (NASDAQ:LRCX), AG Associates (NASDAQ:AGAI), and KLA (NASDAQ:KLAC).
>>