To: Alan Gallaspy who wrote (7632 ) 2/11/1999 10:17:00 PM From: Ian@SI Read Replies (1) | Respond to of 10921
Interesting story from tomorrow's WSJ... I suspect that the reference to 5000 chips a week should be 5000 wafers a week unless of course we're about to see the world's smallest DRAM fab. It's also not clear when Siemens or Motorola will have their first production 300mm fabs - by the end of 2001 when the JV ends or only start building or equipping a fab after 2001. Any guesses??? Ian. +++++++++++++++++ Siemens, Motorola Unveil Advance in Chip Technology By a WALL STREET JOURNAL Staff Reporter BONN -- Siemens AG and Motorola Inc. announced an advance in the production of semiconductors that will allow more chips to be made on a wafer and allow chip makers to cut manufacturing costs by as much as 30%. Company Profile: Motorola Siemens and Motorola are working together to develop new chip-manufacturing equipment that will enable semiconductor makers to produce 2.5 times as many chips on a single wafer. When the joint development effort is concluded by the end of 2001, Siemens said it would build a new facility at its Dresden chip works for around $1 billion to make 5,000 dynamic random-access memory, or DRAM, chips per week. The project, called Semiconductor300, manufactured a fully functional 64-megabyte DRAM for the first time on equipment that uses a 300-millimeter wafer. Previously, chips were manufactured on a 200-millimeter wafer. DRAM chips are used widely in appliances from personal computers to mobile phones. "We expect to achieve cost savings of 30%," said Andreas von Zitzewitz, president of Siemens semiconductors' memory-products division. "Coinciding with the anticipated upturn of the semiconductor market, 300-millimeter technology plays an essential role for the semiconductor industry and its equipment suppliers." There are currently no plans for Siemens and Motorola to cooperate in the production phase, said officials.