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To: FJB who wrote (21088)	2/12/1999 2:42:00 PM
From: BillyG	Respond to of 25960

Intel may want its 300-mm stepper back from Sematech By Jack Robertson semibiznews.com A service of Semiconductor Business News, CMP Media Inc. Story posted 1 p.m. EST/10 a.m., PST, 2/12/99 SANTA CLARA, Calif.--Intel Corp. here is expected to take back the Canon Inc. 300-mm wafer stepper it bought for Sematech several years ago. The company will make it the initial development exposure tool for its projected new development fab in Oregon. Industry sources said Intel is discussing with Sematech the potential transfer of the 300-mm stepper it bought for use by the consortium's International 300-mm Initiative (I300I). That program has since been folded into Sematech's advanced technology program, but the consortium would still like to use the tool if possible. However, there are few other 300-mm lithography platforms available. Canon reportedly isn't building any other development tools, such as the systems now installed at Sematech, the Japanese Selete 300-mm line, and at the joint-venture 300-mm pilot line of Siemens AG and Motorola Inc. in Dresden, Germany. Canon is now working on a production-capable 300-mm system that is expected to be unveiled late this year or early in 2000. Nikon Inc. also said it has a 300-mm development tool, which would be a candidate for the new Intel fab. Intel still declined to comment about widespread industry reports that it will resume stalled construction of a 300-mm development fab, designated D1B, in Oregon. However, Dataquest is estimating that Intel will increase its original $3 billion capital-spending target this year by another $400-to-$600 million to reflect the restarted 300-mm fab project.