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To: Sam Scrutchins who wrote (23208)	2/18/1999 1:46:00 AM
From: J R KARY	Read Replies (2) \| Respond to of 213173

IBM's PowerPC chips maybe destined for a new AAPL server ? " IBM Corp. said today that it will implement silicon-on-insulator (SOI) technology in volume by the end of this year. The company is in San Francisco this week to deliver five papers on its advances in the field at the International Solid-State Circuits Conference. " " ... Davari said the company has already manufactured 64-bit, 550-MHz PowerPC test microprocessors that combined SOI and copper interconnect technologies. By the end of this year, he said IBM will deliver volume quantities of high-performance MPUs for the company's internal server division. Although Apple Computer Inc. is already using a PowerPC chip with copper technology for its high-speed G3 laptop line, and is likely eager to include the SOI version in its systems, Davari could not say exactly when IBM could deliver those PowerPC chips in volume. David Allen, senior engineer for IBM's server division, said SOI technology can boost a chip's performance by as much as 20%. Factoring in the additional 20% to 30% enhancement gained from using copper interconnect and low-k dielectric materials, he said IBM's next-generation devices can be as much as 50% faster than chips using traditional silicon and aluminum manufacturing technology. "SOI will be used in conjunction with copper interconnect. They go hand-in-hand," Davari said. "It's a powerful combination." He predicted that IBM is as much as two years ahead of its competitors in the drive to deliver SOI chips (see story in the Sept. 1, 1998, publication of SBN). " edtn.com Bet IBM will deliver them as soon as INTC's FTC trial ends ! Jim K.