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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?


To: RDM who wrote (51059)2/26/1999 12:42:00 PM
From: kash johal  Read Replies (1) | Respond to of 1571949
 
AMD-K6-III Processor With 3DNow! Technology to Power New Compaq Internet PC; AMD-K6-III/400 Processor-Based Presario 5600s Desktop System Unveiled Today by Compaq, Aimed at Home PC Enthusiasts
Business Wire - February 26, 1999 12:12
SUNNYVALE, Calif.--(BUSINESS WIRE)--Feb. 26, 1999--AMD (NYSE:AMD) today announced that the 400-MHz AMD-K6(R)-III processor with 3DNow!(tm) technology will power a new Presario 5600s desktop PC model, unveiled today by Compaq Computer Corporation (NYSE:CPQ), the world's largest personal computer manufacturer.

"The new Presario 5600s desktop system based on the AMD-K6-III processor is a tremendously powerful PC that gives consumers an exceptional combination of industry-leading processing power, 3D computing capability enhanced by 3DNow! technology, and Internet access and communications features," said S. Atiq Raza, AMD co-chief operating officer and chief technical officer. "Simply put, this is a serious machine for serious enthusiasts, and we applaud Compaq for bringing the cutting edge of PC technology to home consumers."

The new Presario 5600s not only will feature the AMD-K6-III processor's superior performance on leading business and consumer applications, it also will include a 6Mb Max Digital Modem, Phoneline Home Networking, and Compaq's exclusive Digital Creativity Imaging Center with IEEE 1394 support. The Presario 5600s will come bundled with personal productivity, entertainment and Internet access software and is available at Compaq's "Built For You" retail kiosks in the United States.

About the AMD-K6(R)-III Processor

The AMD-K6-III processor with 3DNow! technology incorporates AMD's TriLevel Cache design to enable leading-edge performance for today's consumer PC enthusiasts and business power users. The innovative TriLevel Cache design maximizes the overall system performance of AMD-K6-III processor-based desktop PCs by delivering one of the industry's largest maximum combined system caches. This larger total cache results in higher system performance. The TriLevel Cache design includes a full-speed 64KB Level 1 (L1) cache (a standard feature of the AMD-K6 processor family), an internal full-speed backside 256KB Level 2 (L2) cache, and a 100-MHz frontside bus to an optional external Level 3 (L3) cache on the Super7(tm) motherboard. With a total of 320KB of combined L1 and L2 cache, the AMD-K6-III processor has more internal cache memory than any other x86 CPU available today.

The 21.3-million transistor AMD-K6-III processor is manufactured on AMD's 0.25-micron, five-layer-metal process technology using local interconnect and shallow trench isolation at AMD's Fab 25 wafer fabrication facility in Austin, Texas. The AMD-K6-III processor is packaged in a 100-MHz Super7 platform-compatible, 321-pin ceramic pin grid array (CPGA) package using C4 flip-chip interconnection technology.

About 3DNow!(tm) Technology

3DNow! technology, the first innovation to the x86 architecture that significantly enhances floating-point-intensive 3D graphics and multimedia applications, uses SIMD (Single Instruction Multiple Data) and other performance enhancements to enable a superior visual computing experience. Introduced as a key feature of the AMD-K6-2 processor in May 1998, 3DNow! technology has more than a nine-month time-to-market head start over competing CPU-based 3D enhancement technologies. The worldwide installed base of 3DNow! technology-enhanced PCs is planned to grow to about 14 million systems by the end of this quarter. AMD processors with 3DNow! technology span the complete range of desktop and mobile computing, from sub-$1,000 PCs to high-performance laptops based on the Mobile AMD-K6-2 processor to high-end multimedia desktop systems powered by the new AMD-K6-III processor.

Support for 3DNow! technology exists today in the leading industry-standard application programming interfaces (APIs), including Microsoft's DirectX 6.x and SGI's OpenGL APIs. In addition, numerous hardware and software products have been optimized for 3DNow! technology. Accolade, Activision, Criterion Studios, Digital Anvil, Eidos, GT Interactive, Gremlin, id Software, Interplay, Psygnosis, Rage and 3DO recently announced their support for 3DNow! technology in several of their forthcoming software titles. These publishers and developers join a growing list of software and hardware developers, including Microsoft, IBM, Epic Games, 3Dfx and Matrox, that already support 3DNow! in their leading 3D graphics-intensive applications and hardware. New titles supporting 3DNow! technology continue to be added. For a complete list of hardware and software products that support 3DNow! technology, visit the AMD Web site at www.amd.com/products/cpg/k623d/optimized.html.

About AMD

AMD is a global supplier of integrated circuits for the personal and networked computer and communications markets. AMD produces processors, flash memories, programmable logic devices, and products for communications and networking applications. Founded in 1969 and based in Sunnyvale, Calif., AMD had revenues of $2.5 billion in 1998.

WORLD WIDE WEB: Press announcements and other information about AMD are available on the Internet via the World Wide Web. Type amd.com at the URL prompt. Software titles supporting 3DNow! technology can be found at: amd.com

NOTE TO EDITOR: Readers may obtain additional information by calling 800/222-9323 or 408/749-5703.

AMD, the AMD logo, K6, 3DNow!, and combinations thereof, and Super7 are trademarks, and AMD-K6 is a registered trademark of Advanced Micro Devices Inc. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

CONTACT: AMD, Sunnyvale
Sandra Wheatley, 408/749-3811
sandra.wheatley@amd.com
or
Teresa Camera, 512/602-4425
teresa.camera@amd.com





To: RDM who wrote (51059)2/26/1999 9:10:00 PM
From: Yousef  Read Replies (1) | Respond to of 1571949
 
RDM,

Re: "I appreciate you guidance ... you stated the optical thickness of the
oxide layer but not the insulator thickness of the finished device."

RDM, the final gate oxide thickness doesn't change from the grown thickness.
Polysilicon is deposited right after the gate oxide anneal step and thus
there is no opportunity for the gate thickness to change. Some people
quote "electrical" gate oxide thickness ... For the .25um process, the
"electrical" thickness is typically 42A, but the physical thickness
is about 32A.

Make It So,
Yousef