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To: Gary Wisdom who wrote (16782)	2/27/1999 3:31:00 PM
From: MileHigh	Read Replies (1) \| Respond to of 93625

RVSI Vanguard Announces Processing Capabilities for RDRAM Based Micro BGA Devices CANTON, Mass.--(BUSINESS WIRE)--Feb. 26, 1999--Robotic Vision Systems, Inc. (RVSI) (NASDAQ:ROBV - news) today announced the company's newest capability to perform ball attach processing for the next generation of chip scale packaging technologies, including RDRAM based Micro BGA devices. The company's newest capability utilizes their PowerPlace(TM) integrated ball attach line which includes the VAi 6300 Ball Placement System, reflow oven, cleaner and material handling equipment. Employing new technology advancements to their patented ball placement method has resulted in an integrated ball attach line with the highest throughputs and highest yields for chip scale package (CSP) processing in the industry. more: biz.yahoo.com