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Technology Stocks : Rambus (RMBS) - Eagle or Penguin -- Ignore unavailable to you. Want to Upgrade?

To: REH who wrote (16881)	3/2/1999 9:24:00 AM
From: REH	Respond to of 93625

Mitsui High-Tec To Make, Sell NEC-Designed Chip-Size Package KITAKYUSHU (Nikkei)--Mitsui High-tec Inc. (6966) said Monday that it has obtained rights from NEC Corp. (6701) to make chip-size packages using the through-hole bonding method as well as to sell the products. CSPs made with NEC's Die Dimension Ball Grid Array technology support such high-speed devices as Rambus DRAM. Mitsui High-tec will begin shipping samples in May and will launch mass production in August at a new facility. The company is targeting production of 100,000 units a month by January 2000 and 1 million units a month during fiscal 2001. Investment in the project is estimated at 500 million to 1 billion yen. (The Nikkei Industrial Daily Tuesday edition)