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To: Steve Fancy who wrote (1979)3/3/1999 2:02:00 PM
From: Steve Fancy  Respond to of 3813
 
Chipmakers' Use of Novellus' MOER Process Exceeds One Million Wafers Per Month

CMP-enabling technology helps prevent yield-killing tungsten contamination while maximizing useable wafer surface area

SAN JOSE, Calif.--(BUSINESS WIRE)--March 3, 1999-- Novellus Systems Inc. (Nasdaq:NVLS - news), the productivity and innovation leader in thin film deposition technologies for the global semiconductor industry, today announced that its patented minimal overlap exclusion ring (MOER) process has become a dominant tungsten deposition technology with production usage exceeding one million wafers per month.

biz.yahoo.com