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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Yousef who wrote (51649)	3/4/1999 2:18:00 PM
From: AJ Berger	Respond to of 1573352

I don't know what this means; but ever since the P3 came out, it's been really hard to find any K6's out there in raw form, for clone builders like me...

To: Yousef who wrote (51649)	3/4/1999 2:23:00 PM
From: Scumbria	Read Replies (1) \| Respond to of 1573352

Yousef, I have stated on other occassions that I was on the design team of several high volume (>1,000,000 unit volume) RISC and x86 microprocessors. I am currently doing a 3D graphics design. I also have done PC chipset and system design. Scumbria

To: Yousef who wrote (51649)	3/4/1999 2:51:00 PM
From: Time Traveler	Read Replies (1) \| Respond to of 1573352

Yousef and other semiconductor experts, ICE now has a cross section view of the new IBM PC750 with copper metalization. This process features 7 layers of metal including the first layer of local interconnects. This LI layer appears to be of different material than the other 6 layers of metal. Metal 2, 3, 4, and 5 seem to be of the same thickness. However, metal 6 and 7 are twice as thick as others. The metal seal and barrier also appear very thin. If you have seen or gotten wind of such a cross sectional view, could you make comments on this. Thanks, Time Traveler