To: tech101 who wrote (121 ) 3/16/1999 1:35:00 AM From: tech101 Respond to of 1056
Hyundai selling 90% of ChipPAC unit to U.S. investors for $550 million A service of Semiconductor Business News, CMP Media Inc. Story posted 3 p.m. EST/noon PST, 3/15/99 ICHON, Korea--Hyundai Electronics Industries Co. Ltd. here announced it has agreed to sell 90% interest in its contract semiconductor assembly and testing subsidiary, called ChipPAC Inc., to a group of U.S. investors led by the operation's management. Hyundai said it will receive a combination of cash, stock and debt cancellation with a value of $550 million. Hyundai will also remain a shareholder in ChipPAC. ChipPAC was launched in October 1997 by Hyundai to pursue contract chip packaging and testing services, which has been growing worldwide as semiconductor manufacturers outsource more of their production to third-party companies. Based in Santa Clara, Calif., ChipPAC has been positioned to compete with Amkor Technology Inc., the world's largest chip assembly and testing house which was spun off Korea's Anam Group last year as a publicly trade U.S. company. "By means of this transaction, both Hyundai and ChipPAC will be able to serve their individual markets more fully," said Y.H. Kim, president of Hyundai Electronics, which is attempting to conclude a planned merger with LG Semicon Co. Ltd. of Korea. The ChipPAC transaction is "a further demonstration of [Hyundai's] ability to attract foreign capital to Korea," Kim said. Assisting ChipPAC's management in the transaction is Bain Capital Inc. and SXI Group LLC, which is a Citicorp Venture Capital Ltd. portfolio investment vehicle. "Launching ChipPAC as an independent company represents an exciting opportunity for our customers and employees," said Dennis McKenna, president and CEO of the subsidiary. He said the transaction will enable the operation to focus more resources on serving its customers. ChipPAC said it now has 3,500 employees worldwide, with sales offices in the United States, Japan, Korea, Singapore, and The Netherlands. ChipPAC's packaging and testing facilities are located in Ichon and Shanghai, China. Currently the operation offers a range of chip assembly technologies, from 8-pin to 2,000-pin packages in wire-bond, ball-grid array, chip-scale packaging, and flip-chip interconnect formats. 204.247.196.14