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Technology Stocks : Rambus (RMBS) - Eagle or Penguin -- Ignore unavailable to you. Want to Upgrade?

To: Gary Wisdom who wrote (17427)	3/17/1999 7:40:00 PM
From: Dave B	Read Replies (2) \| Respond to of 93625

Another VLSI Research article... _______________________ March 2, 1999: From the front lines . . . Solutions are emerging to the CSP package speed problem. This has been a real issue for fast devices like Rambus DRAMs, which has recommended the Tessera package. There are alternatives: Flip Chip, FormFactor's new package style, TI's MicroStar CSP and Siemens PSGA should all meet the speed requirements. With Rambus, most manufacturers are saying they will shift to a flip chip CSP solution. They overcoat the wafer with a polymer, pattern it, then bump it, after which, the wafer is diced and the package is finished. If this is reliable, it would be cost competitive with SOJs. ___________________________________ I have nooooo idea what this means. Dave B