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To: WTSherman who wrote (21382)	3/18/1999 8:49:00 AM
From: Zeev Hed	Read Replies (2) \| Respond to of 25960

You are absolutely right, materials will be the next "barrier". Personally, I do not believe that the use of porous dielectrics will withstand the test of long term stability, mostly because such high surface are materials (such as aerogels) have a a very large affinity to water vapors (an omni present threats) and sealing against water vapors penetration (and thus time variable, meaning increasing, dielectric constant as well as filamentary "shorts") is extremely difficult. I think that the solution will come from "unexpected quarters", living with the high dielectric insulators and replacing copper with something better, but I am not free to discuss these kind of things in public (VBG). Zeev